Enhanced Direct-Bonded Copper and Multilayer Ceramic Substrates
Rogers Corporation‘s (NYSE:ROG) Power Electronics Solutions (PES) group will be exhibiting at PCIM Europe and introducing enhanced direct-bonded copper and multilayer ceramic Substrates. Rogers PES will be exhibiting in Hall 9 at Booth 305.
Rogers PES will also be active on the PCIM Europe technical conference schedule, with co-authors Andreas Meyer and Karsten Schmidt participating in the oral session with Fraunhofer Institute IZM, Germany on the topic, “Low inductive SiC Mold Module with Direct Cooling”. This paper will show the double pulse switching results of a full SiC-based power module using a novel packaging architecture with multilayer ceramic substrates and direct liquid cooling. (Wednesday, May 8th, 10:00 AM, Room München 2).
Rogers PES will present a second paper entitled “The Thermal Performance of Si3N4-Based Ceramic Multilayer Substrates” by Tilo Welker, Markus Rüppel, Rainer Herrmann, Olivier Mathieu, Sebastian Polster and Andreas Meyer. This paper will show, using simulation and measurement results, how the thermal performance of multilayer ceramic substrates can be optimized. (Tuesday, May 7th, 11:25 AM, Room München 2)
Visitors to the Rogers booth can learn more about curamik® ceramic substrates designed for high-demand applications. The basis of the substrate is a ceramic isolator to which pure copper is applied. The result is ceramic substrates with high thermal conductivity, great heat capacity and heat spreading provided by the thick copper layer. These high-performance substrates are well-suited for power electronics applications.
Visitors will also have the chance to discover the wide range of ROLINX® customized busbar solutions and assemblies renowned for their reliability, safety, and durability in the most demanding applications including mass transit and electric propulsion, industrial drives, renewable energy, and automotive systems. ROLINX busbar solutions offer low inductance, compact and highly customizable designs and in combination with capacitors, extremely low inductance and high power density capabilities.