Emerson Introduces Horizontal Row Cooler for High Density Computer Systems
Emerson Network Power introduced the Liebert XDH horizontal row cooler to provide efficient and economical cooling for high heat density equipment. Part of Emerson's Liebert XD family of cooling solutions, the Liebert XDH is an extension of Emerson's Liebert XD line of high heat-density cooling solutions that the company claims improves business continuity by supplementing traditional cooling and targeting high density areas. Emerson Network Power pioneered the open approach to high-density cooling with the development of Liebert XD system in 2001. This unique cooling, pumping and piping system delivers high-efficiency cooling by allowing the cooling components to be placed close to the source of heat.
"With the addition of the Liebert XDH horizontal row cooling module to its family of industry leading Liebert XD high density cooling solutions, Emerson Network Power continues to revolutionize high density cooling in the data center with increased higher capacity cooling models," said Steve Madara, Emerson Network Power Vice President and General Manager, Liebert Precision Cooling Business. "The modular and adaptive design of the Liebert XDH greatly extends the scalability and application flexibility of the Liebert XDO overhead cooling module and Liebert XDV vertical cooling module to allow data center managers of new and existing facilities to continue to efficiently accommodate various equipment layouts, support loads that are consistently rising and introduce increased diversity into the data center environment."
The Liebert XDH is designed specifically for data center applications where there is limited overhead space due to overhead cabling or low ceiling height. It fits easily within a row of electronic equipment racks inside a hot-aisle-cold-aisle arrangement and takes advantage of higher heat transfer efficiency by drawing air directly from the hot aisle and moving cool air into the cold aisle. The Liebert XDH can cool more than 30kW per rack and features flexible piping with quick-connect fittings that allow adaptive and scalable expansion, and re-positioning without any interruption of cooling.
The Liebert XDH utilizes the same waterless pumped refrigerant technology as the Liebert XD family. This design provides superior cooling capacity over other chilled water-based designs of the same size, while eliminating the potential for water damage to electronic equipment from leaks. In addition to its superior capacity (the company claims it is the highest rated capacity cooling module on the market), it delivers cooling with 30% less power than the best traditional cooling systems. The Liebert XDH provides the capability of built in redundancy to provide the additional reliability when dealing with high density heat loads. It can be used in conjunction with the existing Liebert XD cooling modules (XDO and XDV) in the same infrastructure arrangement.
