Torex Semiconductor Ltd. held a ceremony for the initial shipment of the new DFN3030-10B “cool post” type package. This package (DFN3030-10B) was developed jointly with KATOH co., ltd.
Its structure employs Cu posts which penetrate the package from its upper surface through to its lower surface, making it a compact, high heat dissipation package which can release coil heat directly to a mounting board (printed board).
Since the coil is located outside of the package, coils can be selected from winding-type (ferrite, metal alloy), laminated, or other types to accommodate the specifications of micro-module products. This will allow micro-modules to have higher operation voltages and larger currents as they continue to become more and more compact.
This package also has excellent properties for product storage and handling (moisture-proofing control) which have enabled it to achieve the grade of MSL-1.
DFN3030-10B Package Features
- Cu posts which pass through the package can release generated coil heat directly to the mounting board.
- Packages are not dependent on coil type, allowing micro-modules to have higher operation voltages and larger currents.
- Optimized for “micro DC-DC” Series