Packaging and Cooling

Compact, High Heat Dissipation “Cool Post”-Type Package

Torex Semiconductor Ltd. held a ceremony for the initial shipment of the new DFN3030-10B “cool post” type package. This package (DFN3030-10B) was developed jointly with KATOH co., ltd.

Its structure employs Cu posts which penetrate the package from its upper surface through to its lower surface, making it a compact, high heat dissipation package which can release coil heat directly to a mounting board (printed board).

Since the coil is located outside of the package, coils can be selected from winding-type (ferrite, metal alloy), laminated, or other types to accommodate the specifications of micro-module products. This will allow micro-modules to have higher operation voltages and larger currents as they continue to become more and more compact.

This package also has excellent properties for product storage and handling (moisture-proofing control) which have enabled it to achieve the grade of MSL-1.

DFN3030-10B Package Features

  • Cu posts which pass through the package can release generated coil heat directly to the mounting board.
  • Packages are not dependent on coil type, allowing micro-modules to have higher operation voltages and larger currents.
  • Optimized for “micro DC-DC” Series

Coil body temperature rise with a 1400-mA current flowing through the coil (click on image to enlarge)

Torex Semiconductor
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