New Industry Products

Circuit Protection for Networking and Mobile Platforms

May 15, 2016 by Jeff Shepard

ProTek Devices has introduced two new circuit protection components that shield a variety of networking, mobile and other computing applications from the destructive effects of electrical transients. The GBLC03CIDNHP is an ultra-low capacitance (0.6pF typical) transient voltage suppressor array (TVS array) available in a bidirectional configuration. The SRV25-4LC is a port protection array that also boasts ultra-low capacitance (1.0pF typical).

ProTek Devices' GBLC03CIDNHP is designed for Ethernet 10/100/1000 Base T, smartphones and other handheld wireless systems, and USB interfaces. It is rated at 500 Watts for an 8/20 micro second waveshape. It meets various IEC standards requirements. This includes 61000-4-2 (ESD): air - 15kV, contact - 8k, exceeding level 4, and handles 10kV contact and 25kV air discharge. It also includes 61000-4-4 (EFT): 40A - 5/50ns and IEC 61000-4-5 (surge). The GBLC03CIDNHP also offers low leakage current and is an ideal replacement for MLV (0805) devices. It protects one power or I/O port and provides ESD protection of > 25kV as well as a low clamping voltage.

The SRV25-4LC is designed for ESD protection in Gigabit Ethernet, smartphones and other similar portable electronics, video card interfaces, USB 2.0 interfaces, and DVI interfaces. It can clamp the effects of electrical fast transients on the power bus. The SRV25-4LC combines eight low-capacitance steering diodes for up to four individual data or transmission lines and one TVS diode for power bus protection. It meets the same IEC standards as the GBLC03CIDNHP. The SRV25-4LC offers 400 Watts peak pulse power per line (typical = 8/20 micro seconds). ESD protection is > 25 kV and it also provides a low clamping voltage. Both devices are RoHS and REACH compliant.

The GBLC03CIDNHP is provided in a molded JEDEC DFN-2 package with an approximate weight of only 0.8 milligrams. The SRV25-4LC is offered in a molded JEDEC DFN-10 package, which minimizes lead inductance to prevent overshoot voltages during high ESD current events. Its approximate weight is just 7 milligrams.

Both devices feature lead-free pure-tin plating (annealed) and a solder reflow temperature of (pure-tin - Sn, 100) 260-270 degrees Celsius. Both parts also have a UL 94V-0 flammability rating and are provided in 8mm tape and reel, per EIA standard 481. The GBLC03CIDNHP is available in minimum quantities of 5,000 and the SRV25-4LC is available in minimum quantities of 3,000.