Vishay Intertechnology, Inc. (Malvern, PA) recently announced that it is sampling the industry's first power MOSFETs in a leadless, 1206 surface-mount package with a total footprint of 3.05mm by 1.80mm. According to Vishay, the Vishay Siliconix ChipFET power MOSFETs occupy approximately half the board area required by a leaded TSOP-6. This allows designers to shrink the power management circuitry for cell phones and notebook computers into about half the space previously needed. The new 1206 ChipFETs have been designed with on-resistance reduced by as much as 35 percent and power dissipation has been increased by as much as 25 percent. On resistance for the single n-channel Si5404DC is 30 milliohms max., with power dissipation of 2.5W. The initial product offering of 10 devices in the 8-pin 1206 package includes ChipFETs available in 8V, 20V and 30V versions with operating voltages as low as 1.8V. Both single and dual devices, including a dual n- and p-channel MOSFET in the same package, are available. As power MOSFET packages have become smaller and smaller, the proportion of the footprint area occupied by the leads has become increasingly significant, said Hamza Yilmaz, senior vice president of Vishay Siliconix. In the case of the TSOP-6, for example, the leads account for almost half the total footprint. With the new ChipFET devices, this wasted PC board space can now be eliminated altogether or used to add new features or capabilities within a smaller area. In quantities of 100,000 pieces, pricing for the devices starts at $0.30 each. Sample and production quantities are current available.