NXP designed the WCT-15WTXAUTO, a 15W multi-coil transmitter reference platform, for AutoSAR in-vehicle wireless charging applications based on the NXP MWCT101xS controller IC...
Premo Group's 3Dpower, a new concept in power magnetics integration, will be one of the highlights of the company's presentations at PCIM...
Spark Connected today announced a proprietary high-performance resonant wireless charging solution, named The Griffin designed and engineered for VR/AR and Gaming applications....
NuCurrent announced the release of its NuEva Development Platform for tightly-coupled, multi-device wireless charging systems. The platform leverages the company’s patented magnetics...
Solace Power announced the release of two new modular, 2nd generation development platforms sharing the same Equus™ architecture and enabling up to...
Integrated Device Technology, Inc. (IDT) launched the WattShare™ family of wireless power semiconductors that enable wireless charging of mobile devices by smartphones....
WiTricity reported that it is working with Furukawa Electric to test an advanced wireless charging system prototype for EVs that uses Furukawa’s...
System developers designing high-end embedded control applications need flexible options to provide scalability as projects increase in complexity. To meet these needs,...
The PMP21495 reference design from Texas Instruments is a 6.6kW, bi-directional, dual-active-bridge resonant converter design that accepts a 380Vdc to 600Vdc input...
Renesas Electronics Corporation and Integrated Device Technology, Inc. (IDT) announced that they received notification by the Committee on Foreign Investment in the...
The Würth Elektronik eiSos launched a new book that adds to its reference book program, at APEC 2019. The company, which claims...
At Applied Power Electronics Conference & Exposition (APEC), GaN Systems displayed a broad variety of innovative design tools including new reference designs...
Infineon Technologies AG introduced its new OptiMOS™ 6 family of MOSFETs. Based on the company’s thin wafer technology, it enables significant performance benefits...
Microchip Technology Inc. announced new dual- and single-core dsPIC33C Digital Signal Controllers (DSCs) with more options to meet changing application requirements across...
TDK Corporation will present its latest power solutions and components at APEC 2019 both #811, March 18-20 in Anaheim, CA. The company...