Central Semiconductor Corp. (Hauppauge, NY) announced the release of a new series of discrete semiconductor devices with enhanced performance specifications. The Enhanced...
Intersil Corp. (Irvine, CA) announced its new ISL4270E 3.0V to 5.5V powered, RS-232 transceiver, which meets ElA/TIA-232 and V.28/V.24 specifications. Additionally, it provides ±15kV ESD protection on transmitter outputs and receiver inputs (RS-232 pins). Targeted applications are PDAs, palmtops, and notebook and laptop computers where the low-operational, and even lower standby power consumption is critical. […]
Turck Inc. (Minneapolis, MN) introduced three new additions to its line of line of high temperature sensors, which range up to 160°C...
STMicroelectronics Inc. (Geneva, Switzerland) introduced a 200A version of its advanced family of IGBTs that features low forward-voltage drops at high currents. Such devices belong to the low drop family of ST's IGBTs that ensure low on-voltage losses without using any heavy metal doping or electronic radiation to reduce the lifetime of minority carries. The […]
Intersil Corp. (Irvine, CA) announced the upgraded Endura™ ISL6558 precision, multi-phase, pulse-width modulated controller IC, which features industrial temperature range and near...
Linear Technology Corp. (LTC, Milpitas, CA) introduced the new LTC4008, a 4A, multi-cell, multi-chemistry, battery pack charger with a solution size of...
Hitachi Ltd. (Japan) announced the release of the HD74ALVC163245 and HD74ALVC164245 high-speed voltage translator ICs that support a 16-bit bus width and...
Qualcomm Inc. (San Diego, CA) announced the availability of the PM6650 power management chip for 3G CDMA terminals. The device is the first member of the company's powerOne family of advanced power management chips and interfaces directly to the company's Mobile Station Modem baseband processors such as the MSM6250 and MSM6500 chipsets. The IC provides […]
Wuxi Xuyang Electronics Co. Ltd. (China) announced its new K Series of bi-directional thyristor diodes (SIDACs), available in DO-15 and DO-201A packages,...
Solar Grade Silicon LLC (SGSilicon, Moses Lake, WA), a joint venture of Advanced Silicon Materials LLC, a subsidiary of Komatsu Ltd. and Silicon Technologies AS, and a subsidiary of Renewable Energy Corp., has begun full production of polycrystalline silicon at its Moses Lake facility. The initial startup has been successful with all polysilicon chemical vapor […]
AVX Corp. (Myrtle Beach, SC) announced that it now offers MIL-qualified ceramic capacitors with space-level reliability. The M123 Series capacitors are designed...
International Rectifier Corp. (IR< El Segundo, CA) introduced four new 12V HEXFET power MOSFETs optimized for low-input voltage (typically 3.3V and 5V),...
Dialog Semiconductor plc (Germany) announced the development of the DA9010 controller IC for Intel's PXA800F cellular processor to be used for GSM/GPRS...
Intersil Corp. (Irvine, CA) announced its new ISL4260E and ISL83386E LINEARLINK RS-232 interface ICs for use in hand-held, battery-powered and space-constrained devices. The ISL4260E is available in a 5mm x 5mm x 0.9mm QFN package, while the ISL83386E is in a 20-lead TSSOP. Both feature three transmitters and two receivers. The devices operate over a […]
National Semiconductor Corp. (Santa Clara, CA) introduced seven mixed-signal power and lighting management application-specific integrated circuits (ASICs) for the hand-held market. The...