The Abbycus V series, released on Kickstarter, are high quality no-compromise power regulators and parametric measurement tools designed for the Raspberry Pi...
A groundbreaking technology that would allow NASA to effectively cool tightly packed instrument electronics and other spaceflight gear is unaffected by weightlessness,...
Toshiba America Electronic Components, Inc. has launched the TC78B027FTG, a three-phase brushless motor control pre-driver IC with Intelligent Phase Control (InPAC) technology...
ZutaCore, a waterless, liquid cooling company unlocking the power of cooling in data centers, announced today that their HyperCool2™ system for direct...
Today AnDAPT™ announced the release of a portfolio of four new Adaptable Power Management Integrated Circuits (Adaptable PMICs) built on its disruptive...
CUI Devices’ Interconnect Group has announced the addition of screwless terminal block connectors for high temperature applications. Featuring wide -40 to +130°C...
Silicon carbide has been undergoing testing for several years within the research sector as a promising alternative material in the semiconductor industry....
Today's computer engineers face two knotty problems. One is on the micro level: As processors are made on smaller and smaller chips,...
The high voltage HVH-280 series from Hirose consists of compact power source interface connectors intended for use in electric equipment such as...
This very powerful fan from Jaro Thermal is one of the highest performing 12V/24W dc fans on the market today, which makes...
The 2019 Heterogeneous Integration Roadmap (HIR) has been released. Designed to stimulate pre-competitive collaboration in order to advance heterogeneous integration technology development...
Jaro Thermal‘s new skived-copper bracket fan contains a fully embedded, leading-edge 50x50x12.6 mm fan – inside of a skived-copper-fin heatsink. Jaro’s unique...
Samsung Electronics Co., Ltd. has developed the industry’s first 12-layer 3D-TSV (Through Silicon Via) technology. The new technology allows for the stacking...
ROHM Semiconductor today announced the availability of six new trench gate structure silicon carbide (SiC) MOSFETs (650V/1200V), the SCT3xxx xR series, optimized...
Efficient Power Conversion Corporation (EPC) announces the publication of the third edition of "GaN Transistors for Efficient Power Conversion," a textbook written...