STMicroelectronics Inc. (Lexington, MA) introduced its latest generation of chip-scale packaging for power-integrated circuits as well as six n-channel MOSFETs that take advantage of the new package to slash size and weight while boosting thermal and electrical performance. The PowerFLAT case, available in 6mm x 5mm and 5mm x 5mm outlines, adopts a micro-lead-frame design […]
Amkor Technology and Philips Semiconductors have entered into a multi-level exchange of technology, a joint development of technology and business-expansion agreements. The agreement is expected to enable both companies to offer enhanced capabilities to the industry segments that they each serve. Both companies will share IP, process knowledge and patent-pending technologies that are already commercially […]
Tessera Inc. (San Jose, CA) announced that Nicholas Colella, Ph.D., has joined Tessera's executive management team as the company's senior vice president of operations. He will be reporting to President and CEO Bruce McWilliams. Colella brings a strong technology and administrative background to Tessera, with more than 21 years of advanced technology experience. In his […]
Power Integrations Inc. (San Jose, CA) announced the availability of a new surface-mount package option for its TOPSwitch-GX product line, a high-power...
The Power Electronics Specialist Conference (PESC) 2002 will be held at the Cairns Convention Centre in Cairns, Queensland, Australia, from June 23-27,...
Fischer Elektronik (Germany) is now offering connectors in 1.27mm, 2mm and 2.54mm modular sizes that can be customized to customer specifications. The...
JARO Components Inc. (Boca Raton, FL) announced the new HTP Series of water-condensing heat pipes designed to cool electronic components when space...
ON Semiconductor (Phoenix, AZ) has launched a new series of n- and p-channel devices, the company's first to utilize ChipFET packaging technology....
Microsemi Corp. (Santa Ana, CA) reported financial results for the quarter ended July 1, 2001. Net sales for the quarter were $60.1 million. Net sales from continuing business for the quarter were $59.5 million, compared with $59.9 million in the third quarter of 2000. Third quarter pro-forma net income increased 39 percent to $4.9 million, […]
COSCO Aluminium Developments Co. Ltd. (China) reports that its new COSCO-7 extruded heatsinks offer increased heat-emissive area and heat-emissive coefficient. The heatsinks...
Chia Cherne Ind. Co. Ltd. (Taiwan) premiered the JAH11C Series of heatsinks designed for CPU coolers in 1U, 2U, slim PC and socket 370A/462 (active) units. The new heatsinks measure 60mm x 60mm, with a thickness of 11.5mm. Chia Cherne's new heatsinks are made of copper C1020. A stacked process has also been employed instead […]
Degree Controls Inc. (degreeC, Milford, NH) announced its entry into the European market with a technical sales and manufacturing engineering support office in Wexford, Ireland, through Thermal Solutions. With degreeC's engineering support, Thermal Solutions will be able to provide integrated products and services such as turn-key fan-tray assemblies, thermal-management controllers, custom heatsinks, thermal analysis and […]
Degree Controls Inc. (Milford, NH) announced the release of the customized Tortoise Back heatsink solution for dc/dc converters used in communications applications. "Given the extreme nature of thermal management issues that the communications industry faces, new designs that resolve specific thermal problems are in strong demand," said Sam Hopp, vice president of sales and marketing. […]
The Department of Energy announced a $3.0 million award to Capstone Turbine Corp. (Chatsworth, CA) to develop microturbine-powered cooling, heating, and power systems. The award is intended for the research, development and testing of packaged cooling, heating and power systems for buildings. "Capstone and the companies that it works with have already made great technological […]
RTP Co. (Winona, MN) announced the opening of RTP Nordic AS (Denmark). RTP's new firm is intended to sell and provide services to molders, extruders and OEMs in Sweden, Norway, Finland, Iceland and Denmark.