TaiSol Electronics Co. Ltd. (China) announced its new CEP411090C heatsink, which features 10 aluminum-extruded fins, measures 37mm x 37mm x 20mm and...
Alcatel (Paris, France) announced its new MTC-80901/80902/80904 family of single-chip, lithium-ion and lithium-polymer battery-protection ICs. With small dimensions (width 3.5mm) it is...
Thermacore International Inc. (Lancaster, PA), a subsidiary of Modine Manufacturing Co., has expanded its line of thermal solutions to include a new...
NMB Minebea (UK) unveiled its new 250mmm backward-curved 250R100 radial blower, which is part of an extensive range of high-efficiency blowers specifically...
The board of directors of Modine Manufacturing Co. (Racine, WI) has elevated Donald Johnson to the positions of Chairman and Chief Executive Officer of the company, and David Rayburn to the positions of President and Chief Operating Officer. Johnson has held the position of President and CEO of Modine since April of 1998. He joined […]
Based on an unfavorable decision from the Japanese patent office Board of Appeals, Modine Manufacturing Co. (Racine, WI) will no longer receive royalty payments in Japan related to its parallel-flow (PF) technology. Since July of 2000, Modine has been receiving royalty payments from Japanese competitors related to its PF patents, which expire in 2006. Over […]
Nanjing No. 11 Radio Fty. (China) announced the MZ Series of PTC thermistors, which withstand up to 900V and are suitable for...
Dynaeon Ind. Co. Ltd. (Taiwan) introduced its new DF1204BA-3 cooling fans, designed for use in 1U rack-mount servers, which measure 40mm x...
Axcelis Technologies Inc. (Beverly, MA) announced that it has formed a cooperative research and development partnership with Fudan University (Shanghai, China) to strengthen the company's long-standing commitment to the region. The partnership brings together Axcelis' expertise in ion implant and rapid thermal processing technologies with China's academic microelectronics research and development center. "China is poised […]
VPT Inc. (Blacksburg, VA) announced that it is offering a new catalog that provides in-depth technical detail on VPT's significantly expanded product...
Fairchild Semiconductor International (San Jose, CA) introduced a total of 11 new MOSFETs, enhancing its portfolio of industry-leading, performance-to-footprint ratio BGA (ball-grid...
Royal Philips Electronics (Eindhoven, the Netherlands) announced the launch of its Loss Free Package (LFPAK), claimed to be the world's first thermally and electrically enhanced version of the industry-standard SO8 package. The new semiconductor package offers improved power handling and thermal resistance by overcoming the thermal limitations of the SO8 package and enabling resistance comparable […]
Amkor Technology Inc. (Chandler, AZ) and Grace Semiconductor Manufacturing Corp. (Shanghai, China) have signed a letter of intent to form a multi-purpose alliance offering total supply chain solutions for customers in the rapidly growing microelectronics market in China. Amkor will become GSMC's customer, with GSMC providing wafer services to Amkor, who will in turn assist […]
NEC Electronics Inc. (Santa Clara, CA) announced it will demonstrate its new V850 NetChip modules at the Embedded Systems Conference in San Francisco. Jointly developed with Innovada, the V850 NetChip module includes the hardware and software required to develop products that can access the Internet, transfer data, and send and receive e-mail. The modules are […]
Analog Devices Inc. (Wilmington, MA) introduced its new 1A ADP3088 and 1.5A ADP3089 1MHz non-synchronous buck switching regulators. Packaged in a 3mm...