Applied Materials Inc. (Santa Clara, CA) introduced its 300mm SlimCell electrochemical plating (ECP) system, likening its technology over that of standard ECP to that of single-wafer processing versus batch processing. Rather than employing a common chemical bath for multiple copper plating cells, SlimCell uses individual chemical baths for each small-volume plating cell. The multi-step capability […]
Mitsubishi Electric Corp. (Tokyo, Japan) introduced a super-high-reliability, dual-in-line package intelligent power module (DIP-IPM) targeted for motor inverter drives of hybrid-electric vehicle (HEV) and fuel cell electric vehicle (FCEV) applications or auxiliary machines. The DIP-IPM product is the first of its kind in the world. Traditional DIP-IPMs are mainly used for inverter drives in home […]
EaglePicher Technologies LLC (Joplin, MO) has signed a supply agreement with GS Battery (USA) Inc., a wholly owned US subsidiary of Japan Storage Battery Co. (JSB). GS Battery will supply its advanced large (50Ah to 190Ah) lithium-ion (Li-Ion) cells and EaglePicher will use its packaging expertise to produce state-of-the-art custom batteries focusing on military and […]
The IRC Inc. Advanced Film Division of TT electronics plc (Patterson, NJ) expanded its offering of thick-film technology, providing design engineers with...
Artesyn North America, a subsidiary of Artesyn Technologies Inc. (Boca Raton, FL), and Astec America, a subsidiary of Emerson's Astec Power (Carlsbad, CA), each reached a second-source licensing agreement with Texas Instruments Inc. (TI, Dallas, TX) to standardize leading technology for high-performance power converters, ensuring interoperability and customer design flexibility. With these agreements, Artesyn, Astec […]
Linear Technology Corp. (LTC, Milpitas, CA) introduced the LT4254, a positive hot-swap controller that allows boards with supplies up to 36V to...
Intersil Corp. (Milpitas, CA) announced the launch of a new family of LINEARLINK™ RS-485/RS-422 high-performance data transceivers that are suitable for factory...
Central Semiconductor Corp. (Hauppauge, NY) announced the release of the CMEDA-6i quad diode array, which consists of a monolithic chip with four,...
STMicroelectronics Inc. (ST, Geneva, Switzerland) announced the new 74VCX1632245 16-bit, dual supply bus transceiver level translator, which is available in a TFBGA54 package, 48-pin TSSOP, or 42-pin FPGA package, and is targeted for use in applications such as mobile phones, PDAs and motherboards. The device provides a two-way, asynchronous, communications interface between buses at 3.3V […]
Astec Power (Carlsbad, CA), a leading supplier of power conversion solutions, announced the arrival of the LPQ142-CF top fan-cooled version of its...
NMB Minebea GmbH (UK) announced that it has added a cost-effective, 101mm, radial blower to its comprehensive product range. With dimensions of...
Advanced Power Technology Inc. (APT, Bend, OR) announced that it has reached an agreement with Infineon Technologies AG, a long-term strategic partner, for purchase of COOLMOS® Power MOSFET die for packaging and selling of finish products under the APT brand name. APT intends to sell into market segments not covered by Infineon Technologies mainly using […]
ChipPAC Inc. (Fremont, CA) announced that it is ready to produce a 10mm x 14mm x 1.2mm, four-chip, stacked package, what it claims is the world's thinnest. The company's previous-generation thin package had a height of 1.4mm. The new package can house four different types of semiconductors, including ASIC and memory chips, in addition to […]
Royal Philips Electronics (Eindhoven, the Netherlands) announced its new small logic, integrated circuit (IC), 24-pin, depopulated, quad flat-pack no-leads (DQFN) package, designed...
Micrel Semiconductor Inc. (San Jose, CA), a leader in power management and high-speed communications integrated circuits, announced a new, dual-channel, hot-swap power controller providing flexible power-sequencing capabilities, the MIC2584 and MIC2585, suitable for RAID system, network server, memory board, cellular base station, network switch, enterprise storage, and hot-board insertion/removal applications. Available in 16-pin and 24-pin […]