Packaging and Cooling

Axcelis Forms R&D Partnership with Fudan University

Axcelis Technologies Inc. (Beverly, MA) announced that it has formed a cooperative research and development partnership with Fudan University (Shanghai, China) to strengthen the company's long-standing commitment to the region. The partnership brings together Axcelis' expertise in ion implant and rapid thermal processing technologies with China's academic microelectronics research and development center.

"China is poised to become one of the top regions for semiconductor technology development," said John Poate, CTO of Axcelis. "Fudan's superb pool of talent, ideas and expertise complements Axcelis' semiconductor process leadership and continually expanding role in the country. The result is a powerful partnership that has the potential to achieve synergistic effects at many levels."

Axcelis Technologies Inc.
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