Accelerating Power System Evaluation and Simplifying Design
ON Semiconductor will be exhibiting and demonstrating new power solutions boards enabled with its Strata Developer Studio™ development platform at APEC 2019 in Anaheim. Strata facilitates the rapid and easy evaluation of solutions for a wide range of applications, allowing users to view devices and analyze their performance in a fully representative context.
Engineers are able to narrow down viable component and systems solutions options and be confident of system performance before committing to sourcing hardware and completing their designs.
Since its launch in January, the Strata Developer Studio cloud-connected development environment, underpinned by its unique value proposition, has generated a high level of interest, with over 730,000 views of an insightful introductory video on the tool.
Visitors to ON Semiconductor’s APEC booth will see new software enhancements, designed to give an improved user experience through intuitive search and selection capabilities, and a carousel-style menu that clearly indicates and allows selection of currently available compatible devices and boards, as well as previewing those coming soon.
Visitors to APEC interested in gaining a deeper understanding of the Strata Developer Studio can attend a presentation on Tuesday, March 19th at 1:30pm being hosted by ON Semiconductor’s Dave Priscak, Vice President Global Solutions Engineering. Dave will present a paper entitled: Satisfying the Pressured Designer’s Wish List with all the Right Tools in Just One Toolbox.
Other on-booth demonstrations will include an 11kW SiC power factor correction (PFC) demonstrator, featuring the new NVHL080N120SC1 SiC MOSFET and NCP51705 integrated SiC Driver. Running on 3-phase full bridge PFC at a switching speed of 100kHz, this demo shows the advantage of MOSFETs with regards to switching losses versus an IBGT design.
Also on display will be new eFuse and Smart Passive Sensors for industrial automation, a high density USB-PD solution, an active-clamp flyback solution, and new innovations around core and auxiliary power conversion and motor driver power modules.