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• Power Integrations Virtual Booth – APEC 2020

  Presented By Power Integrations, Inc.

  At the Power Integrations virtual booth, you can find details of PI’s technical presentations and product demos originally planned for APEC 2020. Highlights include PowiGaN™ gallium nitride...

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  130 Published April 29, 2020 Rx and Tx Coils for Portable Electronics and Qi Wireless Charging Pads

  136 Published April 29, 2020 Controlled Switching Device for HV Circuit Breakers 145 Published April 29, 2020 BLE SoCs Add Point-To-Point Distance Measurement to Help Stop COVID-19 Spread 139 Published April 29, 2020 Space-Qualified Programmable Integrated Current Limiter

  44 Published May 1, 2020 Reducing the Carbon Footprint of Artificial Intelligence

  76 Published April 30, 2020 U.S. Manufacturing of Advanced Perovskites Consortium Established 83 Published April 30, 2020 Control of Crystalline Imperfections within SiC for Wide Bandgap Applications 180 Published April 29, 2020 SK Innovation Ups Investment in U.S. EV Battery Business to $2.5 Billion

  145 Published April 29, 2020 BLE SoCs Add Point-To-Point Distance Measurement to Help Stop COVID-19 Spread

  420 Published April 28, 2020 Single-Ended, 2-Channel GaN Class D Amplifier – Evaluation Board 251 Published April 27, 2020 EMC Line Filters and EMC Filter Design Kit 347 Published April 27, 2020 Micrometals Helps Engineers “Find and Design Faster” with Inductor Cores

  44 Published May 1, 2020 Reducing the Carbon Footprint of Artificial Intelligence

  394 Published April 24, 2020 Batteryless Biofuel Cell Powered Electronic Skin Can Monitor Health 384 Published April 17, 2020 Untwisting Plastics for Energy Harvesting and Charging Internet-of-Things Devices 417 Published April 10, 2020 Light-Emitting Silicon Paves the Way for Photonic Chips

  Power Integrations Virtual Booth – APEC 2020 Presented By Power Integrations, Inc.

  IRS2452AM Class D Amplifier IC Presented By Infineon Technologies Benefits of GaN e-mode HEMTs in wireless power transfer Presented By Infineon Technologies MERUS™ Multilevel Class D Audio Amplifier Supports Ultra-compact and Low-power Applications Presented By Infineon Technologies

• 83
  Published April 30, 2020

  Control of Crystalline Imperfections within SiC for Wide Bandgap Applications

  Growth of high-quality substrates for microelectronic applications is one of the key elements helping drive society toward a more sustainable green economy. Today, silicon plays a central...

• 170
  Published April 29, 2020

  Pre-Integrated Cellular IoT Network Coverage in 200+ Countries and Territories

  Cellular networks will be the communication backbone for billions of mobile devices and machines connected to the Internet of Things (IoT). At the core of this development...

• 156
  Published April 29, 2020

  Surface Mount Aluminum Electrolytic Capacitors with ESRs as low as 0.08Ω

  Panasonic Industry Europe has added the FN series of surface-mount, low ESR aluminum electrolytic capacitors to its product line-up. Available from a rated voltage of 6.3Vdc to...

• 226
  Published April 29, 2020

  Biosolar Cell Could Power Sensors for the Internet of Things

  Binghamton University Watson School Assistant Professor Seokheun "Sean" Choi has built a new biosolar cell measuring just 3.5 by 2.4 centimeters that can generate electricity using two...

• 251
  Published April 29, 2020

  3DIC Compiler Platform Delivers Power, Thermal, and Noise-Aware Optimization

  Synopsys, Inc. has introduced its 3DIC Compiler platform to transform the design and integration of complex 2.5 and 3D multi-die system in a package. It provides an...

• 561
  Published April 24, 2020

  250W Digital LLC DC-DC Converter with GaN Power FETs – Reference Design

  The fully digital design of the KV46 digital LLC dc-dc converter reference design is based on NXP‘s HVP-LLC development board. The HVP-LLC dev board is an integral...

• 205
  Published April 22, 2020

  Sanan IC Adds High-Voltage Wide Bandgap Power Semi Foundry Platform

  Sanan Integrated Circuit Co., Ltd. announced worldwide access to its growing portfolio of advanced, wide bandgap power semiconductor foundry services for 650V and 1200V silicon carbide (SiC)...

• 570
  Published April 3, 2020

  Creating Stretchable Thermoelectric Generators to Power Wearables

  Researchers at the Laboratory of Organic Electronics at Linköping University have developed an organic composite material with unique properties - not only is it soft and stretchable,...

• 477
  Published March 27, 2020

  Stretchable Supercapacitors to Power Tomorrow’s Wearable Devices

  Researchers at Duke University and Michigan State University have engineered a novel type of supercapacitor that remains fully functional even when stretched to eight times its original...

• Gallium Nitride Technology in Server and Telecom Applications

  Presented By Infineon Technologies

  The promise of GaN in light of future requirements for power electronics This paper will discuss the benefits of e-mode GaN HEMTs in high power applications such...

• Digital Compensator Design for LLC Resonant Converter

  Presented By Microchip Technology Inc.

  A half-bridge LLC resonant converter with Zero Voltage Switching (ZVS) and Pulse Frequency Modulation (PFM) is a widely used topology for DC/DC conversion. A Digital Signal Controller...

PowerPulse Product Perspective

Most-read new product stories in July from 5-, 10- and 15-years ago. Another PowerPulse exclusive.