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PowerPulseDaily for September 11, 2019

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Today's Top Stories

  1. New Products:
    DC Power Supplies and Electronic Loads for the bench
  2. Industry News:
    Multi-Rail Power Sequencer and Monitor IP Blocks Reference Design
  3. Friday Feature:
    Insulation Technique May Pave the Way for More Powerful and Smaller Chips

Featured

Power Spotlight
"Benefits of GaN e-mode HEMTs in wireless power transfer"

Presented by

 

 

More New Products

  1. Capacitive Incremental Encodes Support Shaft Sizes up to 5/8 in (15.875 mm)
  2. 40V and 60V Dual N-Channel Power MOSFETs in PDFN56 Dual Package
  3. 40W AC-DCs in 2 x 2 Inch Package Deliver 80W Peak Power
  4. Peltier Coolers Provide Thermal Stability in Smart DLP Automotive Headlights

More Industry News

  1. Stretchy Plastic Electrolytes Could Enable New Lithium-Ion Battery Design
  2. Corvus Energy Opens Maritime Battery Factory in Norway
  3. HCL Technologies Acquires Sankalp Semiconductor
  4. DuPont Electronics & Imaging Divests SiC Wafer Business to SK Siltron

More Power to You

  1. Power Topics

Today's Top Stories

DC Power Supplies and Electronic Loads for the bench

Teledyne LeCroy announced the addition of electronic loads and dc power supplies for the electronics test engineering bench to the Teledyne Test Tools (T3) portfolio of test equipment. With these…

Multi-Rail Power Sequencer and Monitor IP Blocks Reference Design

The Multi-Rail Power Sequencer and Monitor reference design from Intel Corp. is a highly parameterizable set of IP blocks that can be customized to meet specific power sequencing needs. It controls…

Insulation Technique May Pave the Way for More Powerful and Smaller Chips

Researchers at KU Leuven and imec have successfully developed a new technique to insulate microchips. The technique uses metal-organic frameworks, a new type of materials consisting of structured nanopores. In…
 

Featured

Power Spotlight
"Benefits of GaN e-mode HEMTs in wireless power transfer"

Presented by

The following paper demonstrates the advantages of gallium nitride (GaN) enhancement mode (e-mode) HEMT devices over MOSFETs in two power amplifier topologies that have been proposed for wireless power... Read More
 

More New Products

Capacitive Incremental Encodes Support Shaft Sizes up to 5/8 in (15.875 mm)

CUI's Motion Group announced the addition of a new series to its innovative AMT incremental encoder family designed to support larger motor shaft sizes from 9mm to 15.875mm (5/8 inch).…

40V and 60V Dual N-Channel Power MOSFETs in PDFN56 Dual Package

Taiwan Semiconductor Co., Ltd. has expanded its product portfolio with Dual N-Channel Power MOSFETs in a PDFN56 dual package. Samples and products are in stock and available now.

40W AC-DCs in 2 x 2 Inch Package Deliver 80W Peak Power

The CFM41S series from Cincon are 40-Watt high-density class II ac-dc power supplies that provides 40W continuous output (up to 80W peak) of regulated power in a 2 x 2…

Peltier Coolers Provide Thermal Stability in Smart DLP Automotive Headlights

Digital light processing (DLP) technology is now used in many smart automotive headlight systems to cast sharper and brighter light in front of a vehicle. These automotive headlight systems operate…
 

More Industry News

Stretchy Plastic Electrolytes Could Enable New Lithium-Ion Battery Design

In a bid to develop alternative designs for lithium-based batteries with less reliance on expensive metals such as cobalt and nickel, researchers at the Georgia Institute of Technology have developed…

Corvus Energy Opens Maritime Battery Factory in Norway

Corvus Energy celebrated the grand opening of its automated battery factory in Bergen, Norway. Yesterday, approximately 450 guests from around the globe attended the opening ceremony, representing ship owners and…

HCL Technologies Acquires Sankalp Semiconductor

HCL Technologies Limited (HCL) today announced the acquisition of Sankalp Semiconductor, an advanced technology design services provider offering comprehensive digital & mixed signal SoC services and solutions from concept to…

DuPont Electronics & Imaging Divests SiC Wafer Business to SK Siltron

DuPont Electronics & Imaging (E&I) today announced it has signed an agreement to sell its Compound Semiconductor Solutions (CSS) business to SK Siltron for an estimated $450 million. CSS is…

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