Infineon Technologies Bipolar GmbH & Co. KG has expanded its product portfolio of thyristor/diode modules. The new Prime Block 50mm power modules feature solder bond technology and the 60mm power modules pressure contact technology. They are designed for highest performance when the desired current exceeds 600A for a 60mm footprint or 330A for a 50mm footprint.
This avoids the paralleling of modules when this is not an option. Prime Block modules are designed for industrial ac and dc motor drives as well as for rectifiers and bypasses in uninterruptible power supplies (UPS).
The new modules have been optimized for better thermal resistance and higher operational temperatures to push their performance beyond the existing limits. As a result, the Prime Block achieves the highest power density in its respective footprint while maintaining the well-known reliability, which leads to an outstanding lifetime. The pressure contact modules in general provide best-in-class blocking stability, the solder bond modules fully undergo an X-ray monitoring after the soldering process.
The variant in the 60mm standard housing comes in the topologies of thyristor/thyristor and thyristor/diode with a blocking voltage of either 1600V or 2200V and in current ratings from 700A to 820A.
The 50mm standard housing variant is offered in the topologies of thyristor/thyristor, thyristor/diode and diode/diode. Its blocking voltage stands at 1600V, 1800V and 2200V, the modules supports current ratings of up to 390A.
The new 50- and 60-mm Prime Block family is available in high quantities. The next portfolio extension will support customers with pre-applied Thermal Interface Material (TIM). This not only keeps production lines fast and clean, additionally it further improves thermal behavior.