In August, Toshiba Electronic Devices & Storage Corporation will start mass production and shipments of the TPWR7904PB and TPW1R104PB, 40V N-channel power MOSFETs for automotive applications. They are housed in the DSOP Advance(WF) packages that deliver double-sided cooling, low resistance, and small size.
The new products secure high heat dissipation and low On-resistance characteristics by mounting a U-MOS IX-H series chip, a MOSFET with the latest trench structure, into a DSOP Advance(WF) package. Heat generated by conduction loss is effectively dissipated, improving the flexibility of thermal design.
The U-MOS IX-H series also delivers lower switching noise than Toshiba's previous U-MOS IV series, contributing to lower EMI. The DSOP Advance(WF) package has a wettable flank terminal structure.
Anticipated applications include Electric power steering, Load switches, Electric pumps, and similar automotive systems.
- Qualified for AEC-Q101, suitable for automotive applications
- Double-sided cooling package with top plate and drain
- Improved AOI visibility due to wettable flank structure
- U-MOS IX-H series featuring low On-resistance and low noise characteristics