40V AEC-Q101 MOSFETs with 3.3mΩ RDS(on) in 3mm x 3mm Package

Nexperia introduced a family of low RDS(on) 40V AEC-Q101 MOSFETs targeting space-constricted, power modules in demanding powertrain applications. The MOSFETs are housed in the miniature, LFPAK33 package which has a footprint of only 10.9mm² and a pitch of just 0.65mm. The devices use Nexperia’s Trench 9 technology, resulting in a reduction in RDS(on) of 48% compared to the company’s previous devices.

For this new portfolio of MOSFETs, the company improved power density, thermal performance, and reduced space compared to its previous models. The portfolio of MOSFETs covers a range of applications from 30W up to 300W including water, oil, and fuel pumps. The BUK7M3R3-40H and BUK9M3R3-40H (Standard Level and Logic Level) devices feature an RDS(on) of just 3.3mΩ.

Reduced RDS(on) and improved current capability allows the LFPAK33 package to replace larger power styles at a lower cost with comparable product performance. This improved performance can enhance application designs that previously used the company’s DPAK-packaged devices which are 80% larger than LFPAK33 devices. (See image above for comparison).

Rugged, Trench 9 Superjunction technology also provides a higher avalanche capability and greater Safe Operating Area (SOA) for improved performance under fault conditions.

Richard Ogden, Nexperia’s product manager, commented, “Automotive design engineers continue to innovate – especially in applications such as water, fuel and oil pumps, and engine filters – focusing on reducing module size but with increasing power requirements. Our Trench 9 automotive LFPAK33 MOSFETs are a good fit for these thermally-demanding powertrain systems since the unique LFPAK technology absorbs thermal stresses. Other automotive applications include parking brakes, airbag systems, LED Lighting, seat control & heating, window lift, and driver infotainment systems.”

Nexperia says its LFPAK33 40V MOSFET family represents the industry’s largest portfolio of devices in a 3mm x 3mm footprint, with an additional 16 Standard Level and Logic Level devices.

The company says that the devices are qualified to AEC-Q101, and they exceed the requirements of this standard by more than two times.

  • Improved RDS(on) and current capability
    • allows LFPKA33 to replace larger power packages at a lower cost
  • Lower RDS(on) in a smaller package
    • opens up higher power applications (up to 300W) in a smaller footprint
  • Super-junction technology designed for higher avalanche capability
    • high SOA capability and strong fault condition tolerance
  • Automotive AEC-Q101 qualified
    • exceeding 2x AEC-Q101 testing on key reliability tests


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