At APEC 2019, TDK debuted what the company claims to be the smallest point-of-load dc-dc converter included in its new series of µPOL™ power solutions. The New series of µPOL™ of power management solutions boasts increased performance, smallest available size, ease of use and simplified integration.
Primary applicaitons for the power management series include Network storage, servers, Netcoms, Telecoms, Ethernet Switches and Routers, as well as 5G Small Cells and 5G Base Stations.
Scalable and highly configurable, the series features multi-time programmable memory, offering a wide range of flexibility. The series is suitable for applications including big data, machine learning, artificial intelligence (AI), 5G cells, IoT, and computing enterprise
Rather than using side by side discrete integrated circuit (IC) and discrete inductor (L) the new FS series integrates the IC and inductor in a compact configuration which offers a high-density solution for space-constrained applications requiring a low-profile power source.
Measuring 3.3mm x 3.3mm x 1.5mm, they minimize the required external components, maintaining the highest possible performance while offering a simplified design for ease of integration.
This family can deliver a high-density solution of 1 watt per mm3, in a 50% smaller solution size than the other products available in its class. As a result, the smaller size minimizes system solution cost, reduces board size and assembly costs, as well as BOM and PCB costs. It operates at a broad junction temperature range, from -40 °C to 125 °C. Mass production of FS1406 is expected to begin in Q3 2019.
TDK has been developing patents related to these innovations (US 9,729,059 and US 10,193,442) over several years. Faraday Semi, TDK’s group company developed µPOL. The power management solutions take advantage of advanced packaging technologies such as semiconductor embedded in substrate (SESUB) and advanced electronic components to achieve unique system integration in a smaller size and lower profile by 3D integration.
TDK insists that this integration allows it to deliver higher efficiency and ease of use at a lower total system cost than currently available power management solutions.
μPOL™ technology includes a dc-dc converter placed in the vicinity of complex chipsets such as ASICs, FPGAs, and others. Minimizing the distance between the converter and the chipset, also minimizes the resistance and the inductance components, allowing fast response and accurate regulation with dynamic load currents.
The product family is rated for industrial applications, is lead-free and ROHS compliant. The series comes in three variants FS1406, FS1404, and FS1403. These variants are rated at 6A, 4A, and 3A respectively.
Main Features and Benefits
- Footprint of 3.3 x 3.3 x 1.5 mm
- Output of 1 watt per mm3, with 50% less required capacitance than existing products
- Suitable for a junction temperature range from -40°C to 125°C
TDK is showcasing its µPOL™ technology at APEC 2019 from March 18 to 20 at the Anaheim Convention Center in Anaheim, CA at booth 811.