Components

1200V IGBT Modules Rated to 100A with 20% Lower Rds(on)

Infineon Technologies AG introduced its new 1200V TRENCHSTOP™ IGBT7 and emitter-controlled EC7 diode. The IGBTs deliver higher power density, lower system cost, and reduced system size.

Packaged in the company’s Easy housing, the power module fits the needs of industrial drives applications. Other targeted applications include servos and CACs.

Based on Infineon’s new micro-pattern trench technology, the TRENCHSTOP IGBT7 chip operates with much lower static losses compared to the IGBT4. Its on-state voltage is reduced by 20%. This reduction brings a significant loss decrease in the application, especially for industrial drives, which usually operate at moderate switching frequencies.

The power modules, the IGBT7 Easy 1-A (see image above), and the Easy 2-B feature a maximum allowed over-load junction temperature of 175°C. They also feature softer switching and offer an improved controllability.

Infineon designed the new 1200V modules with the same pinout as TRENCHSTOP IGBT4 modules, which helps reduce design efforts. More importantly, the new modules enable a higher output current from the same package, or a similar output current from a smaller package. As a result, more compact inverter designs are possible.

TRENCHSTOP IGBT7 Easy 2B

All module types are equipped with Infineon’s reliable PressFit mounting technology for low ohmic resistance and reduced process time.

The new TRENCHSTOP IGBT7 technology comes in an industry-standard EasyPIM™ housing for the current classes 10A and 25A. For more power, the EasyPACK 2B carries 100A. Lead types are FP10R12W1T7_B11, FP25R12W1T7_B11, and FS100R12W2T7_B11.

Features
  • Lowest on state voltage Vce(sat) and Vf
  • Tvj op=175°C at over-load
  • Enhanced controllability of dv/dt
  • Optimized switching losses for dv/dt = 5kV/µs
  • 8μs short-circuit robustness
  • Improved FWD softness
  • Higher power density due to use of smaller power modules (e.g. 25A PIM in Easy1B)
  • Low losses to meet energy efficiency requirements
  • Optimized trade-off between losses and EMI
  • Lower system cost
Infineon Technologies AG
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