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Video Coverage
APEC 2007: Bonus Coverage
Tyco Electronics
Multiple families of high-current-density connectors including designs optimized for hot-plug and microTCA applications.
Green Building Power Forum 2010
Darnell's Digital Power Forum 2009
Green Building Power Forum 2009
nanoPower Forum 2009
APEC 2009
Darnell's Digital Power Forum 2008
Brian Fortenberry, EPRI Solutions
John Jovalusky, Qspeed Semiconductor
Power Electronics Tour of Ireland
Power Electronics Industry Group
Advanced Magnetics Characterization Lab
Stokes Research Institute Overview
Prof. John Shen, University of Central Florida
Dr. Fred Roozeboom, NXP Semiconductors
Jose Cobos, Technical University of Madrid
Dr. Cian OMathuna, Tyndall National Institute
Leo Warmerdam, PhD, NXP Semiconductors
Seamus ODriscoll, Texas Instruments
Prof. Seth Sanders, University of California, Berkeley
Bruno Allard, Ampere Laboratory
Darnell's Digital Power Forum 2008
nanoPower Forum 2008
PCIM Europe 2008
APEC 2008
Consumer Electronics Show 2008
Electric Vehicle Symposium 23
Darnell's Digital Power Europe 2007
Fairchild Semiconductor's 50th Anniversary
Darnell's Digital Power Forum 2007
Mohan Mankikar, President, Micro Tech Consultants
Brian Zahnstecher, Hardware Development Engineer, Hewlett Packard
Bob White, Staff Engineer, Astec Emerson Network Power