New Industry Products

Universal Scientific Industrial Intros SiP Module

July 29, 2003 by Jeff Shepard

Universal Scientific Industrial Co. Ltd. (Taiwan) announced its new SiP module that combines Agere Systems' Wi-Fi and Cambridge Silicon Radio's Bluetooth technology. The module is suitable for use in portable products such as smartphones, PDAs, digital cameras, camcorders and printers.

With its SiP design and manufacturing capability in microelectronic packaging, RF-technology, and multi-chip module capabilities, the module achieves miniaturization, interference reduction and the best RF efficiency. Measuring 22mm x 29mm x 3.3mm, it is 20% the size of a miniPCI card.