New Industry Products
Universal Scientific Industrial Intros SiP Module
July 29, 2003 by Jeff Shepard
Universal Scientific Industrial Co. Ltd. (Taiwan) announced its new SiP module that combines Agere Systems' Wi-Fi and Cambridge Silicon Radio's Bluetooth technology. The module is suitable for use in portable products such as smartphones, PDAs, digital cameras, camcorders and printers.
With its SiP design and manufacturing capability in microelectronic packaging, RF-technology, and multi-chip module capabilities, the module achieves miniaturization, interference reduction and the best RF efficiency. Measuring 22mm x 29mm x 3.3mm, it is 20% the size of a miniPCI card.