New Industry Products

uIPM-DIP Power Modules for Low Power Motor Drive Applications

May 26, 2014 by Jeff Shepard

International Rectifier Corp (IR) has introduced the µIPM™-DIP family of highly integrated, compact Integrated Power Modules (IPM) for low power motor drive applications including fans, pumps, air purifiers and refrigerator compressor drives. Available in a compact 12 x 29mm SOP/DIP package, IR's µIPM™-DIP product family offers a cost effective power solution by leveraging industry standard footprints and processes compatible with various PCB substrates. The family of 32 new devices features rugged and efficient high-voltage FredFET MOSFETs specifically optimized for variable frequency drives with voltage ratings of 250V or 500V. These devices are paired with IR's most advanced high-voltage driver IC tuned to achieve optimal balance between EMI and switching losses. The µIPM™-DIP family offers DC current ratings ranging up to 4.6A to drive motors up to 150W without a heatsink and are available in both through-hole and surface mount package options.

“By utilizing industry standard package footprints, IR’s µIPM™-DIP family is a significant expansion of the µIPM™ integrated power module family. The new portfolio of µIPM™-DIP modules offers designers and system integrators a cost-effective, pin-to-pin compatible solution for advanced motor control for low power applications that require improved thermal performance and overall system size reduction while using traditional PCB assembly technology,” said Alberto Guerra, Vice President, Strategic Market Development, IR’s Energy Saving Products Business Unit.

The new µIPM™-DIP modules are an addition to IR’s iMOTION™ design platform which integrates digital, analog and power technologies together in a flexible, mixed signal chipset to simplify motor control designs and bring energy-efficient, cost-effective solutions to market faster. Pricing for the µIPM™-DIP family begins at US $2.75 each in 10,000 unit quantities. Production quantities are available immediately.