New Industry Products

Toshiba Releases 35A Synchronous Step-Down Converter Multi-Chip Module For DC-DC Converters

February 21, 2008 by Jeff Shepard

Toshiba America Electronic Components, Inc. (TAEC) announced that it has expanded its family of power multi-chip modules (MCM) with a synchronous step-down converter switching module for various applications such as mobile computers, servers, and network equipment. The TB7005FL features output current of 35A and an operating frequency up to 1MHz, making it suitable for high-power CPUs and other point-of-load modules.

The TB7005FL module combines a new MOSFET gate driver IC for 5V operation with high-side and low-side MOSFETs produced from Toshiba UMOS V-H process technology. The low-side MOSFET minimizes on-state resistance (RDS(ON)), gate-to-drain capacitance (Cgd), Cgd/Cgs ratio, and gate resistance (Rg), and the high-side MOSFET is optimized for fast switching, achieved through low gate switch charge (QSW) and gate resistance (Rg).

"By using a compact MCM instead of individual discrete components, designers can improve efficiency by eliminating the parasitic inductances associated with the individual discrete packages as well as save significant board space," said Jeff Lo, Business development Manager, Power Devices, for TAEC. "At switching frequency of 750kHz, the TB7005FL achieves greater than 90% peak efficiency."

The Toshiba TB7005FL MCM features a wide input voltage range up to 30V. It also includes a built-in high performance switch to drive an external boot strap capacitor and a built-in shutdown switch for the low-side MOSFET, which when set to low turns off that MOSFET. Offered in small, thin packages, the 35A Toshiba TB7005FL measures 8.0 x 8.0mm in a QFN56 package.

Samples of the 35A Toshiba TB7005FL are available now, priced at $3.50 each. Mass production is scheduled to start in the first Quarter of 2008.