New Industry Products

Trench-Type SiC MOSFET has 50% Lower On-Resistance

June 04, 2015 by Jeff Shepard

ROHM Co., Ltd. announced the development and mass production of an SiC MOSFET that adopts the world's first trench structure. Compared to existing planar-type SiC MOSFETs, ON resistance is reduced by 50% in the same chip size, making it possible to significantly decrease power loss in a variety of equipment, from industrial inverters and power supplies to power conditioners for solar power systems.

ROHM’s latest offering is a SiC MOSFET featuring a trench structure that maximizes SiC characteristics, claiming a groundbreaking milestone with significant implications worldwide. Optimum performance is achieved by combining exceedingly low loss with high-speed switching performance. As a result, efficiency during power conversion is improved and waste eliminated during production, contributing to increased miniaturization, lighter weight, and greater energy savings in a variety of equipment. And going forward ROHM is developing full SiC modules that integrate both SiC MOSFETs and SBDs.

Key Features: 1. Original trench structure utilized to achieve lower ON resistance. Although adopting a trench construction in SiC MOSFETs has been attracting increased attention due to its effectiveness in reducing ON resistance, there is a need to establish a structure for mitigating the electric field generated in the trench gate portion in order to guarantee long-term reliability. ROHM was able to meet this need and successfully mass-produce the industry’s first trench-type SiC MOSFETs by utilizing a proprietary structure. As a result, switching performance is improved (approx. 35% lower input capacitance) and ON resistance reduced by 50% over planar-type SiC MOSFETs.

2. Full SiC power module development. ROHM has also developed a full SiC power module that incorporates these latest trench-type SiC MOSFETs in a 2-in-1 circuit with integrated SiC SBDs. In addition, the 1200V/180A module features the same rated current as Si IGBT modules while reducing switching loss by approximately 42% vs. planar-type SiC MOSFETs.

The product line up includes a full SiC power module and three discrete devices for each rated voltage: 650V and 1200V, with rated currents of 118A (650V) and 95A (1200V).