New Industry Products

STMicroelectronics Offers STmite Power Package

January 16, 2003 by Jeff Shepard

STMicroelectronics Inc. (Geneva, Switzerland) introduced an ultra-thin package for power control devices used in hand-held applications such as mobile phones, PDAs and notebooks. The new STmite package has a maximum thickness of 1.15mm and its footprint is half that of an SMA package and yet it has the same low thermal resistance. A clip is used for the connection to the die, ensuring the device can handle high peak currents. The package has been registered under the JEDEC standard DO-216AA.

The first parts to benefit from the package are a range of schottky diodes and a 200W transient-voltage suppressor. The schottky diodes in the STmite are intended to be used in battery chargers, dc/dc converters and auxiliary power supplies, while the transient-voltage suppressors in the package are designed to protect sensitive ICs from over-voltages in a wide range of applications where space is at a premium.

The package is delivered with lead-free terminals, is compatible with lead-free soldering profiles and pick-and-place equipment, and allows solder joints to be inspected during mounting on board. Pricing for the STmite is $0.10 in quantities of 500,000 units.