Royal Philips Electronics (Eindhoven, Netherlands) announced the introduction of a new range of power MOSFETs in miniature power packages. The new QLPAK is an innovative new semiconductor package that combines small size with efficient thermal properties. The package is suitable for use in high-density power applications such as dc/dc converters for telecommunications.
The QLPAK occupies the same 6mm x 5mm printed circuit board area as a conventional SO8 package, but is thermally superior. The QLPAK has a thermal resistance of 1.5K/W compared to the SO8 package, which typically has a thermal resistance in excess of 20K/W. The new package design allows significantly cooler running at any given power level when compared to the industry-standard S08 package. The QLPAK is also approximately 50 percent thinner than the current SO8 package and footprint compatible.
The new QLPAK is currently sampling. Volume production will begin in August 2002. Pricing starts at $1.95 in quantities of 100 pieces.
