Techniplas today announced that Nano Dimension joined its open innovation program to make available for the first time to the automotive industry additive manufacturing of conductive components, encapsulated sensors and smart surfaces.
This partnership brings together Techniplas’ cognitive lighting technology with Nano Dimension’s 3D printed electronics to deliver new ways of designing and manufacturing electronic conductive paths directly into the interior and facia surfaces of cars in a single step.
Nano Dimension is the first company to embed conductive paths and print antennas into shapes, and 3D print fully functioning printed circuit boards, the heart of all electronic devices. The company invites CES 2018 attendees to stop by Techniplas booth #9100 located in the Las Vegas Convention Center North Hall and experience first-hand the powerful combination of these technologies.
As part of this partnership, Nano Dimension plans to bring its industrial-grade DragonFly 2020 Pro 3D Printer into the Techniplas additive manufacturing Innovation Center, and apply its extensive advanced inkjet engineering materials expertise to accelerate the development of next-generation cognitive connected vehicle parts, components, and systems.
“We are thrilled to welcome Nano Dimension as a member of our program which brings together today’s best and most innovative players and technologies,” said Techniplas founder and chairman George Votis. “With Nano Dimension on board, we are the first to bring additive electronics capabilities to our automotive customers.”
“Techniplas’ open innovation program is fast becoming the preeminent hub for innovative 3D printing companies to validate and mainstream their additive manufacturing solutions for the automotive industry,” said Nano Dimension CEO Amit Dror. “Together, we plan to lay the foundation for a new era of connected mobility and automotive products that are unencumbered by traditional design and manufacturing restrictions.”
Nano Dimension’s flagship DragonFly 2020 Pro 3D Printer is poised to transform electronic additive manufacturing by empowering companies to take control of their entire development cycle. The award-winning system enables the 3D-printing of functional electronics such as sensors, conductive geometries, antennas, molded connected devices, printed circuit boards and other devices.
Nano Dimension joins like-minded innovative partners, including DWS, Sharebot and Sicnova as part of Techniplas’ Open Innovation Program, to fundamentally push the traditional boundaries of automotive manufacturing. Techniplas’ continued commitment to the open innovation is supported by its focus on developing partnerships that see mutual benefits in each other’s capabilities and strengths.
With a breadth of in-house capabilities ranging from jigs and fixtures to larger scale prototypes, and short run manufacturing of end-use parts, Techniplas and its innovation partners are well on their way toward industry 4.0 readiness.