Due to multiple sources with Vincotech owned tools, the housing supply chain security has now been ensured for the company’s MiniSKiiP® PIM (CIB) and MiniSKiiP® sixpack configurations. Furthermore, a successful expansion of a highly-automated production facility will even improve the distribution reliability.
Now, Vincotech has extended its range of MiniSKiiP® products with the new IGBT M7 chip. This new IGBT M7 chip delivers the dual benefits of superior performance and multiple sourcing to minimize customers‘ supply chain risks.
The new MiniSKiiP® PIM (CIB) and MiniSKiiP® sixpack configurations have power ranges extending up to 200A.
The main benefits of the new module designs include: Multiple sourcing for enhanced supply chain security; Lower power losses and improved efficiency; Extended power range for easily scalable inverter designs; and Pre-applied, high performance thermal paste (HPTP) for superior thermal performance
General MiniSKiiP® Features
- Solder-free SPRiNG Technology for shortest assembly time
- Without copper baseplate for cost efficiency
- Easy and flexible PCB routing without pin holes
- Real chip-level multiple sourcing: TRENCHSTOPTM IGBT3/IGBT4 and new IGBT M7 with low VCEsat
- Open emitter configuration
- Kelvin emitter for improved switching performance
- 5kV DC test isolation voltage (t = 2sec)
- Compatible pin out for IGBT4 and IGBT M7
- Built in NTC
MiniSKiiP® PIM features:
- Single- and three-phase rectifier (standard/enhanced)
- 600V and 1200V components
- Available from 5A up to 100A
- For inverter designs up to 45kW
MiniSKiiP® Sixpack features:
- Sixpack or twin sixpack configuration
- 600V and 1200V components
- Available from 10A up to 200A (with IGBT M7)
