Mitsubishi Electric Corporation announced today the launch of its 1,200V large transfer-mold dual in-line package intelligent power module (DIPIPM™) Ver.6 and 1,200V Mini DIPIPM using sixth-generation IGBT chips featuring the carrier-stored trench-gate bipolar transistor (CSTBT™) structure. Both modules reduce the power consumption, size and weight of inverter systems for motors used in air conditioners and industrial applications. Sales are scheduled to begin September 30. The new models are targeted at air conditioners, industrial power converters and similar applications and will be exhibited at Motortech Japan 2014 during Techno-Frontier 2014 at Tokyo Big Sight in Japan from July 23 to 25.
These products enable reduced power consumption and simpler design for inverter systems. The sixth-generation IGBT chips featuring the CSTBT structure enable power loss to be reduced by about 10% compared to Mitsubishi Electric’s existing Large DIPIPM products (Large DIPIPM Ver.4 series, 5A-35A). Reduced external components thanks to built-in bootstrap diode (BSD) with current limit resistor. Reduced heat dissipation is enabled by improving the accuracy of the temperature detection sensor output.
The Mini DIPIPM package enables reduced size and weight in critical applications, By employing a Mini DIPIPM package for the first time in a 1,200V product, the profile (31.0 x 52.5mm) was reduced about 34% compared with Mitsubishi Electric’s existing Large DIPIPM Ver.4 series (31.0 x 79.0mm). The Large DIPIPM is offered with current ratings from 5A to 50A while the Mini DIPIPM is available with current ratings of 5A and 10A.