Power Components

Mitsubishi Electric US to Exhibit at IEEE APEC for the First Time

Mitsubishi Electric US, Inc., Semiconductor and Device Division will exhibit for the first time at Applied Power Electronics Conference (APEC) in San Antonio, March 5-7, 2018.  The Semiconductor and Device Group will display its full lineup of power semiconductor products (formerly the Mitsubishi Products and Accessories Division of Powerex, Inc.) in booth #919.

The full lineup of products on display includes: the revolutionary new 7th Generation IGBTs, G1 Series IPMs, Version 6 DIPIPMs (Dual Inline Package Intelligent Power Module), SLIMDIPs (Slim Dual Inline Package), DIPIPM+, J1-Series Automotive modules, X-Series High Voltage IGBTs (Insulated Gate Bipolar Transistor), and SiC (Silicon Carbide) solutions.

Mitsubishi Electric power modules are manufactured with state-of-the-art technologies that ensure the highest levels of performance and reliability while offering impressive energy savings for the products and systems they’re used in.

The line-up of products is extensive, ranging from power modules developed to control high-voltage power generation, industrial manufacturing and railway systems to applications in home products, such as controlling the electricity used by air conditioners, washing machines and refrigerators. Products include:

  • Intelligent Power Modules (IPMs)
  • IGBT Modules
  • HVIGBT Modules / HV Diodes
  • Power MOSFET Modules
  • Diode Modules

Mitsubishi Electric’s line-up of power semiconductors includes High-Voltage ICs (HVICs). Mitsubishi's HVIC include various built-in protection functions and use input signals from a microcomputer or other device to directly drive gates in power MOSFETs or IGBTs.

In addition, two papers will be presented by the MEUS Application Engineering Team:

  • Dual High Voltage IGBT Modules with Metal Casting Direct Bonding (MCB) Baseplate; Presented by Junya Sakai, Eric Motto, and Mike Rogers, Wednesday, March 7, 2018, 16:35-17:00, Room 213
  • Exhibitor Seminar: Latest Power Semiconductor Packaging and Chip Technology; Presented by Eric Motto, Wednesday, March 7, 2018, 12:00-12:30p, Room 217D
Mitsubishi Electric Corp.
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