New Industry Products
JARO Components Announces HTP Series of Water-Cooling Heat Pipes
July 31, 2001 by Jeff Shepard
JARO Components Inc. (Boca Raton, FL) announced the new HTP Series of water-condensing heat pipes designed to cool electronic components when space is an issue. Typical applications include notebook computers, audio components and power supplies.
The new HTP Series heat pipes are designed to be affixed to transfer plates, which are then mounted to the component in need of cooling. Based on customer specifications, the heat pipe travels around neighboring components to the opposite end, where the heat is dissipated through the use of aluminum fins and heatsinks, where space is more available.
Pricing for the customized HTP Series depends on the design.
