IXYS Releases New Family of Power Semiconductors
IXYS Corp. (Santa Clara, CA) announced the introduction of an extended new family of power semiconductors in the new isolated TO-220 package. The new plastic package, called ISOPLUS220, has the holeless TO-220 outline, but with a DCB ceramic lead-frame based on the company's ISOPLUS technology.
The new devices announced include new trench-technology MOSFETs in the 55V and 75V range, with 100A to 200A ratings, and CoolMOS 600V power MOSFETs with 20A and 0.14 ohm ratings. IXYS reports that the package simplifies the device assembly and may be mounted directly onto a heatsink, with no isolation-interface material. The company maintains that the use of a DCB substrate in place of a copper-lead frame results in a lower isolated thermal resistance junction-to-heatsink, increased temperature and power-cycling capabilities, reduced stray junction-to-heatsink capacitance, and reduced radiated EMI in HF switching. In addition, the DCB lead frame enables additional circuit configurations.
"With these innovative products, we provide our customers with higher power capability in an integrated mode in a standard, small, discrete package. It is an addition to our ISOPLUS product family," commented Dr. Nathan Zommer, CEO of IXYS.
The average selling prices of the new devices range from $1.50 to $5.70 in 1,000-piece quantities.
