IXYS adds Modified D2-Pak and D3-Pak for Higher Voltages

IXYS Corporation announced the extension of the D2-Pak (TO-263) and D3-Pak (TO-268) packages without middle terminal for higher-voltage solutions that require surface mount devices (SMD) with enlarged creepage distances. Prior SMD solutions with standard discrete components did not offer practicable solutions for applications higher than 1200V. The new IXYS D2-Pak and D3-Pak designs now offer a recommended and standardized footprint, but with compliance to the high-voltage 'creepage' specifications.

For D3-Pak the creepage distance between terminal and copper backside is greater than or equal to 5.80mm. This enables the use of 1.2kV D3-Pak in pollution degree 2 industrial designs. For the D2-Pak, the creepage distance between terminal and copper backside is greater than or equal to 4.70mm. In addition to industrial power control applications, these devices target other applications with 1.2kV to 1.8kV such as power supplies, UPS, renewable energy, motor drives and medical applications.

“The new D2 and D3-Pak design without a middle pin provides creepage distances that fulfill standard demands without any additional arrangements. This allows cost effective solutions because a reduction in size and weight are achievable without a reduction in energy efficiency. Integrated power design with small modules can be replaced with low cost SMD alternatives providing more automated and faster assembly structures and an increase in reliability,” states Dr. Elmar Wisotzki, Director of Technology at IXYS Germany. “The expansion of our product portfolio in the SMD high voltage range is a reaction to the growing demand for compact PCB designs for higher voltage applications between 1200V and 1800V.”

The extended product portfolio now allows designers to choose from several SCR topologies, standard rectifiers and also IXYS’ dual SCR DT-Triac solutions. Fast diodes and SiC MosFet products complete the current product range.