International Rectifier Corp. (IR, El Segundo, CA) debuted what it claims is the smallest schottky diode in the industry, the IR140CSP FlipKY™ device, which utilizes standard ball-grid array technology and occupies a total area of 2.25mm², or is 86% smaller than the standard SMA package. The FlipKY is suitable for hand-held, portable equipment such as cellular phones, PDAs, notebook computers, hand-held computers, MP3 players and hard disk drives.
The 1A, 40V schottky diode is a four-ball, 1.5mm x 1.5mm device with a profile of less than 0.8mm. The FlipKY revolutionizes the low-power schottky diode market by eliminating the lead frame and epoxy traditionally used in other devices. BGA technology enables size reduction and better heat transfer away from the die junction to the circuit board. Since the device is made with true chip-scale packaging, it dissipates heat directly from the die into the air, increasing thermal efficiency; thermal resistance junction-to-ambient is rated at 75°C/W maximum and thermal resistance junction-to-PCB is typically 55°C/W.
The new IR140CSP FlipKY device is available immediately, and is priced at $0.25 each in 10,000-unit quantities.