INCEP Technologies Inc. (San Diego, CA) announced it has completed a $6.0 million round of equity funding led by a major strategic investor that is focused on bringing high-performance microprocessor solutions to market. INCEP’s previous investors also participated in the round.
The company plans on using its new funds to complete development of its third-generation package for microprocessors, which combines the microprocessor die and its chip-carrier substrates with the microprocessor’s power conditioning circuitry; a single, combined microprocessor and power supply heat-dissipating device; and an EMI containment and retention solution.
"This is obviously the most challenging market environment in which to raise money," said INCEP CEO and co-founder Jim Kaskade. "The industry is back to the basics - make a unique product that addresses a strong need and applies to a huge market. This is INCEP’s business model."
