Vincotech today announced the release of six new product families powered by IGBT M7 chips. Featuring sixpack, PIM and half-bridge topologies, these new modules deliver the dual benefits of superior performance and multiple sourcing to minimize customers’ supply chain risks.
Featuring new ultra-thin wafer processing technology and optimized cell design, IGBT M7 (7th-gen Mitsubishi) chips achieve very low VCEsat to reduce static losses by 20%. With the new RFC (relaxed field of cathode) diodes and suppressed snap-off recovery, engineers will find it far easier to optimize the inverter’s EMC and cut overall system costs. The IGBT M7 chips are housed in the industry-standard flow, MiniSKiiP® and the new VINco E3 packages.
These modules are designed to enable manufacturers in the motion control market to come up with flexible, scalable inverter designs. This initial release is for 1200V applications with a power range of 75A to 690A. Modules for currents ranging below 75A will soon follow.