GaN Enhances Efficiency of Redundant Power Supplies
Telcodium in collaboration with Transphorm Inc. has released the industry's first redundant power supplies using GaN FETs. Telcodium's AC Series replaces a typical three-module power supply architecture (two power supply bricks and one intermediate bus converter (IBC)) with a single power module with redundant ac feeds. There are five models in this series that deliver 300W, 400W, 500W, 750W and 1,000W of 12-V output power. Telcodium's power module operates at 94 percent or higher True System Efficiency (TSE), defined by power supply module efficiency plus IBC efficiency, reducing average energy loss by 13 percent or more.
To achieve the same TSE with the typical three-module power supply, the bricks and IBC would each need to yield a 97 percent efficiency—which exceeds the 80Plus Titanium specification and has yet to be demonstrated by any power supply manufacturer. Further, the new module is 30 percent smaller than the above mentioned two bricks and eliminates the standalone IBC—freeing considerable, critical space inside a host system.
The high TSE and size reduction are made possible by Telcodium’s innovative design. This design pairs patented front-end circuitry with the market’s only JEDEC-qualified 650V GaN FET, available from GaN semiconductor design and manufacturing leader Transphorm. The resulting AC Series enables data center, server and telecommunication manufacturers to develop smaller, high-performing systems that can virtually eliminate power supply-related failures.
The following features combined with others not highlighted here can potentially reduce an average system’s total cost of ownership by 19 percent: Patented front-end circuit design integrated with 650V GaN FETs realizes over 94 percent true system efficiency and over 80 percent standby power reduction (to less than 1W); Over 30 percent size reduction + standalone IBC elimination results in internal circuitry and system components reduction, increased airflow and reduced floor space Increased mean time between failure (MBTF);
Reduced internal system temperature increases the mean time between failure (MBTF); Internal supply monitoring (voltage, current and frequency) results in cleanest power selection and accommodates automatic extreme event logging and supplemental device reduction (e.g., power line monitors); ORing function elimination reduces the mechanical parts for greater reliability and reduced maintenance over time
The AC Series’ universal form factor (260 x 100 x 40mm) is lightweight (1.36 Kg) and fits common equipment developed by data center, server and telecommunications manufacturers. Products are available today and short delivery windows average in-stock to 6 weeks.
