New Industry Products

Fujipoly Offers Sarcon SF-Nd Interface Materials

September 16, 2002 by Jeff Shepard

Fujipoly America Corp. (Carteret, NJ) announced its new Sarcon® SF-Nd phase-change interface materials for use in high-performance microprocessors requiring minimal thermal resistance for maximum heatsink performance and processor reliability. The SF-Nd materials have a low thermal resistance, a flexible product size and good workability.

No preheating of the heatsink is needed and there is no air holding between the metal surface and the product to prevent performance degradation. The SF-Nd features a thickness of 0.130mm, a thermal resistance of 0.015 degrees C(in²)/W, a thermal conductivity of 2.0W/mK, and a phase-change temperature of about 60 degrees C.