New Industry Products

Fairchild Intros FDZ2551N/3N/2P/4P MOSFET BGAs

July 31, 2002 by Jeff Shepard

Fairchild Semiconductor International (San Jose, CA) introduced two new dual n-channel and two new dual p-channel 20V MOSFET ball-grid array (BGA) products with physical and electrical performance characteristics suitable for lithium-ion battery pack protection applications. The new BGAs address the needs of space-sensitive, performance-oriented, load-management applications used in computer/EDP, communication, portable, industrial equipment and wireless communication products, such as cell phone handsets, PDAs, web tablets, MP3 players and portable POS terminals.

Each of the four devices (FDZ2551N, FDZ2553N, FDZ2552P and FDZ2554P) is housed in a 4mm x 2.5mm, surface-mount, MOSFET BGA package featuring a common drain connection. The BGA packaging results in a small 10mm² footprint, an 0.8mm low-profile, excellent RDS(on) and outstanding thermal performance. With a profile approximately 21 percent lower than a TSOP-6 package, the MOSFET BGAs can achieve up to 79 percent lower RDS(on) than competitive dual 20V, TSOP-6, p-channel MOSFETs, according to the company. In addition to the lower absolute RDS(on) values, the dual MOSFET BGAs also feature a lower FFOM than other TSOP-6 or micro-lead-frame packages.

The FDZ2551N, FDZ2553N, FDZ2552P and FDZ2554P are available in tape-and-reel packaging. Pricing for the FDZ2551N is $1.44, the FDZ2552P is $1.49, the FDZ2553N is $1.56 and the FDZ2554P is $1.59. Samples and production quantities are available now, with lead times of eight weeks or more for larger orders.