ECPE Partners with Japanese Researchers on ISOGap and SiC-DCBreaker WBG Projects
The Power Electronics Cluster in ECPE e.V. headquartered in Nuremberg, together with selected Cluster stakeholders, is partnering with the Japanese Power Electronics Consortium NPERC-J to develop an SiC-based electronic dc circuit breaker and is partnering with the University of Osaka to develop high-temperature materials and reliability testing for the new-generation of wide bandgap (WBG) power electronics.
Under the German Federal Ministry of Education and Research (BMBF) funding initiative for the internationalization of excellent clusters, future projects and comparable networks, the Power Electronics Cluster coordinates an international research cooperation between Cluster stakeholders and the Japanese Power Electronics Consortium NPERC-J headquartered in Tokyo.
The SiC-DCBreaker project is about electronic circuit breaker for dc networks based on SiC technology.
Also under the BMBF funding initiative for the internationalization of excellent clusters, future projects and comparable networks, the Power Electronics Cluster coordinates an international research cooperation between Cluster stakeholders and an industrial consortium around the University of Osaka.
The IsoGap project is about high temperature materials and reliability testing for the new generation of wide bandgap power electronics.
SiC-DCBreaker
In a two-year conception phase, the Power Electronics Cluster in ECPE e.V. has developed an internationalization concept for a research cooperation with Japan. This involves novel wide bandgap power semiconductors (silicon carbide, SiC and gallium nitride, GaN) and their system integration. In the following implementation phase of the cluster internationalization, two BMBF joint research projects, IsoGap and SiC-DCBreaker, were launched on 1 August 2018, with a term of three years and a total funding of three million euros.
In the SiC-DCBreaker project the cooperation partners on the German side, Infineon Technologies AG, Robert Bosch GmbH, Grass Power Electronics GmbH, ETA Elektrotechnische Apparate GmbH, the Institute IALB of Bremen University, the Fraunhofer Institute IISB and the Power Electronics Cluster in ECPE e.V. work on SiC-based circuit breakers for dc grids in high-voltage automotive on-board networks of electric vehicles as well as for applications in dc networks in buildings with PV supply.
The Japanese sub-consortium includes university and industry partners from the NPERC-J consortium (New Generation Power Electronics and System Research Consortium Japan).
IsoGap
Also in a two-year conception phase, the Power Electronics Cluster in ECPE e.V. has developed an internationalization concept for a research cooperation with Japan. This involves novel wide bandgap power semiconductors (silicon carbide, SiC and gallium nitride, GaN) and their system integration. In the following implementation phase of the cluster internationalization, two BMBF joint research projects, IsoGap and SiC-DCBreaker, were launched on 1 August 2018, with a term of three years and a total funding of three million euros.
In the IsoGap project the cooperation partners on the German side, Conti Temic microelectronic GmbH, Rogers Germany GmbH, Plasma Parylene Systems GmbH, Zestron / Dr. OK. Wack Chemie GmbH, the IALB Institute of the Bremen University, the Fraunhofer Institute IISB and the Power Electronics Cluster in ECPE e.V. work on insulation systems for highly integrated wide bandgap power semiconductor modules as well as on extended reliability tests.
The Japanese sub-consortium coordinated by the University of Osaka includes major materials companies for high-temperature assembly and interconnection technologies.
