New Industry Products

Dynex Releases New Trench Gate IGBT Modules

May 21, 2003 by Jeff Shepard

Dynex Semiconductor Ltd. (Lincoln, UK) announced the release of three new IGBT module product ranges at 1,200V, 1,700V and 3,500V in single, half-bridge, chopper and dual-switch circuit configurations for high-reliability applications. Typical applications for the new modules will include high-reliability inverters such as wind turbines and motor controllers, and railway traction drives.

The 1,200V and 1,700V modules incorporate trench field-stop technology while the 3,500V modules feature soft punch-through technology. Switching and conduction losses are significantly reduced in comparison to previous module ranges. In addition to the 200A to 2,400A ratings presently offered, Dynex will also offer 1,200A dual and 3,600A single switches with 1,200V and 1,700V ratings. All modules are optimised for high thermal cycling and are available in industry-standard footprint packages constructed with isolated metal-matrix baseplates and AlN substrates.