Chromerics (Woburn, MA) introduced its new THERMFLOW T766 phase-change material, which provides a low thermal resistance path between hot components and heatsinks while allowing easy removal of sinks for reworking operations.
The T766 pads include a foil layer that allows heatsinks to be removed without force and without leaving residue to be cleaned from component surfaces. The material consists of a tacky, electrically non-conductive phase-change film on one side of a conformable metal foil. The film attaches securely onto heatsinks or spreaders and is protected by the foil layer during assembly. The construction allows the pad to conform to mounting surfaces on thermal modules in laptop computers, microprocessors in PCs, workstations and servers, and BGA packages.
The film of the patent-pending THERMFLOW T766 softens at component operating temperatures to fill air gaps and enhance the performance of heatsinks and spreaders. The T766 pads are supplied kiss-cut on rolls for easy installation. Standard square pad sizes measure 0.70in x 1.0in x 1.25in. Custom shapes are also available and prices start at less than $0.08 per pad in large volumes.
