Chomerics Introduces PowerSite Semiconductor Attachment Technology

Chomerics (Woburn, MA), a division of Parker Hannifin Corp. (Cleveland, OH), introduced PowerSite, an automated power semiconductor attachment technology. The PowerSite process enables direct mounting of power semiconductors onto heat sinks without metal fasteners. Chomerics' automated PowerSite process selectively bonds insulated copper pads onto aluminum heat sinks, allowing TO-220 or TO-247 power devices to be solder-mounted.

PowerSite technology utilizes a high-temperature adhesive coated on both sides of a 1mm Kapton MT film to laminate 1 ounce copper foil pads to aluminum heat sinks. Most stamped or extruded heat sinks may be integrated into PowerSite assembly equipment. Each copper pad or “PowerSite" provides an interface with thermal impedance as low as 0.1 degree C-inch-squared per W. The Kapton MT film layer provides electrical insulation, achieving a voltage breakdown of 5,000Vac.