Vishay Intertechnology, Inc. has introduced the ThermaWick™ THJP series surface-mount thermal jumper chips. The Vishay Dale Thin Film devices allow designers to...
Absopluse Electronics has released the CSI 1K-24/230-3XD3-HSF, a 1kVA addition its line of IP66-rated dc-ac sine wave inverters with pure convection cooling....
TactoTek, the Finland-based company that develops, industrializes and licenses in-mold structural electronics (IMSE™), and Lightworks GmbH, a leading automotive lighting design and...
Infineon Technologies AG has expanded its CoolSiC™ Schottky diode 1200V portfolio by adding six devices in a D²PAK real 2-pin package. Using...
Mitsubishi Electric Corporation has developed a new technology to integrate power devices, passives, sensors and other embedded components in the same substrate,...
A UCLA-led research team has produced in unprecedented detail experimental three-dimensional maps of the atoms in a so-called 2D material — matter...
A room-temperature bonding technique for integrating wide bandgap materials such as gallium nitride (GaN) with thermally conducting materials such as diamond could...
Due to the increasing spread of covid-19 in Europe, Mesago Messe Frankfurt GmbH has decided to postpone the PCIM Europe exhibition and...
Infineon Technologies AG expects significant growth in automotive 48V systems in the coming years and is expanding its portfolio of suitable power...
A research group led by Simone Fabiano at the Laboratory of Organic Electronics, Linköping University, has created an organic material with superb...
The APEC 2020 Organizing Committee has issued the following statement: “In light of growing concerns surrounding the COVID-19 outbreak, and after much...
The newly-developed D35XB80 from Shindengen Electric has the same appearance as the standard 5S package of insulated SIP single-phase bridge diodes but...
CISSOID has introduced a new 3-phase 1200V/450A silicon carbide MOSFET intelligent power module (IPM) platform for E-mobility. This new IPM technology offers...
Texas Instruments (TI) has introduced the industry’s first digital isolator that is qualified to the Grade 0 ambient operating temperature specification of...
EV Group (EVG) has established the Heterogeneous Integration Competence Center™, which is designed to assist customers in leveraging EVG's process solutions and...