Modine Manufacturing Co. (Racine, WI) reported continued improvement in its financial results for the first quarter ended June 26, 2003. Sales for the first quarter increased 6% to $288.9 million from $272.3 million reported a year ago. Net favorable currency exchange rates, primarily the stronger Euro, added about $21.4 million to first quarter sales. Earnings […]
Fairchild Semiconductor International (South Portland, ME) announced that the company has initiated conversion of all products to lead-free (Pb-free) finish packages. Conversion will continue through the remainder of this year and is expected to be completed by June 2004. Fairchild launched its Pb-free initiative to provide its customers with lead-free package finishes, responding to concerns […]
Tianjin Development Area Xinzhong Electronic Co. Ltd. (China) introduced its CC1 Series of ceramic capacitors that are suitable for resonance and temperature...
Global Win Tech Co. Ltd. (Taiwan) announced its new WE482 cooling fan that supports up to Pentium 4 3.06GHz, and features a...
Linear Technology Corp. (LTC, Milpitas, CA) introduced the LTC4240, an I_C Hot-Swap™ controller that allows a board to be safely inserted and...
An employee shot and killed three co-workers and wounded four others at a Modine Manufacturing Co. (Racine, WI) manufacturing plant on the...
Emerson Process Management, an Emerson (St. Louis, MO) business, announced that it has won a $16 million contract to modernize the Ataka Thermal Power Station in the Suez region of Egypt using its PlantWeb® digital plant architecture. Emerson will serve as the main automation contractor for instrumentation and control modernization of Ataka's two 150MW units […]
ON Semiconductor Corp. (Phoenix, AZ) introduced five new protection devices that integrate multiple transient voltage suppression (TVS) components into a single 1.6mm...
Royal Philips Electronics (Eindhoven, the Netherlands) announced a breakthrough in Schottky diode semiconductor technology that reduces power dissipation to such low levels...
Analog Devices Inc. (ADI, Wilmington, MA) announced its new ADT7461 enhanced digital temperature sensor with capabilities important for next-generation processors. The new temp sensor can monitor a wide temperature range, and automatically cancels temperature errors due to resistance in series with the remote sensor. The ADT7461 is well suited for a range of applications, including […]
ON Semiconductor Corp. (Phoenix, AZ) added the SOD-123FL package to its portfolio of discrete components. Fifty devices, including transient voltage suppression (TVS) components and Schottky diodes, are now available in the low-profile, flat-lead package. Additional devices will become available in the new packaging later this year. The devices are suitable for board-space-conscious portable applications. The […]
Ansoft Corp. (Pittsburgh) recently joined the Synopsys in-Sync® program to improve the interoperability between Synopsys' Encore™ chip packaging software, HSPICE®, the golden standard for accurate circuit simulation, and Ansoft's HFSS™, SIwave™, Spicelink™ and Turbo Package Analyzer™. "Design-tool interoperability is critical for the design of complex ICs, PCBs, IC packages and high-speed components," said Karen Bartleson, […]
Adept Technology Inc. (San Jose, CA), a manufacturer of flexible automation for the semiconductor, electronics, fiber optic, telecommunications and life sciences industries, introduced the new Adept Film-Frame Handler platform for back-end metrology and advanced packaging process equipment. The system is designed to provide high film-frame capacity and fast swap times to maximize utilization of any […]
Texas Instruments Inc. (TI, Dallas, TX) announced a new hot-plug power controller that provides design flexibility and higher power efficiency when controlling...
Emerson (St. Louis, MO) announced that it has been awarded a $1.5 million contract to provide cooling protection for data center operations in the new Tokyo headquarters of global investment banking firm Goldman Sachs. Emerson Network Power will provide precision cooling systems from its Liebert division to help Goldman Sachs' data center deliver state-of-the-art performance […]