Nitronex Corp. (Raleigh, NC), a privately held manufacturer of gallium nitride (GaN)-based, radio frequency (RF) power transistors, announced that it has been...
Xinruilian Electronics Co. Ltd. (China) announced its XRL-HS-565 60mm to 80mm, high-static-pressure, cooling fan that has a rated voltage of 12Vdc and...
INCEP Technologies Inc. (San Diego, CA) announced that it has entered into a manufacturing agreement with Celestica. INCEP will leverage Celestica's operations in Asia, Europe and the Americas to provide its OEM customers with industry-leading quality, technology and supply chain management, enabling faster time-to-market, scalability and manufacturing efficiency. INCEP is working with Celestica to help […]
Microsemi Corp. (Irvine, CA), a leading manufacturer of discrete semiconductors and power management integrated circuits, has launched a new family of OR'ing Schottky barrier rectifiers providing low forward-voltage specifications and high efficiency. The new rectifiers, which extend Microsemi's OR'ing portfolio, have power ratings from 1A to 240A and are particularly well suited for hot-swap power […]
Tessera Technologies Inc. (San Jose, CA), a developer of semiconductor packaging technology for miniaturization of electronic products, announced that Sanyo Electric Co. Ltd. and Tessera have signed a new licensing agreement. Under this agreement, SANYO has licensed Tessera's semiconductor packaging technology to package semiconductor devices utilized in a variety of consumer electronic products. The addition […]
SynQor Inc. (Hudson, MA) announced a new line of high-current, high-efficiency, half-brick, dc/dc converters to its PowerQor® Peta Series, which can deliver...
A newly developed product from GrafTech International Ltd.'s (GTI, Wilmington, DE) eGRAF electronic thermal management product line was recognized by R&D Magazine as one of the 100 most technologically significant products introduced globally over the last year. GrafTech introduced the eGRAF line of electronic thermal management products in 2001 to meet the increasing thermal management […]
XPiQ Inc. (Holliston, MA), a worldwide manufacturer and supplier of ac/dc and dc/dc power supply products, announced the latest addition to the...
TriQuint Semiconductor Inc. (Hillsboro, OR) announced that it is collaborating with Amkor Technology Inc. to commercialize a low-cost, flip-chip, assembly process for GaAs semiconductors based on TriQuint's CuFlip bumping technology. Using CuFlip copper bumps, electrical connections are possible by directly linking contact points on a semiconductor die to the module ceramic or laminate substrate. The […]
Tessera Technologies Inc. (San Jose, CA), a developer of semiconductor packaging technology for miniaturization of electronic products, announced the filing of a registration statement for the initial public offering of up to $75 million of its common stock. The securities to be offered in the proposed IPO will include shares to be issued and sold […]
Samsung Electronics Co. Ltd. (Seoul, Korea) announced the development of a 1Gb, double data rate (DDR), SDRAM, die-stack, chip-scale package (CSP) that offers two 512Mb DDR SDRAM dies in a single package. The new package solution doubles memory density and at the same time, resolves the design constraints of mobile applications and high-performance servers that […]
Maxon Precision Motors Inc. (Burlingame, CA) introduced its new EC 90 Series of brushless pancake motors, which are electronically commutated, thus enabling...
Infranor Inc. (Naugatuck, CT) announced the new MSA Series pancake servo motors, which provide 20% more output than the standard MA pancake motors. The new servo motors claim to have one of the highest torque per weight/volume ratios in the servo motor industry. The flat geometry provides high dynamic acceleration with short electrical and mechanical […]
Power Paper Ltd. (Tel Aviv, Israel), a provider of thin and flexible micro-power source technology and devices, and KSW Microtec AG, a leading provider of low-cost, advanced electronic packaging technologies for radio frequency identification (RFID) and smart card solutions, announced that it has broadened its strategic relationship to leverage the growing demand for thin and […]
Actel Corp. (Mountain View, CA) announced the availability of its reprogrammable, non-volatile ProASIC Plus field-programmable gate arrays (FPGAs), tested and verified to operate over the full military temperature range of -55°C to +125°C. With densities ranging from 300,000 to one million system gates, the single-chip, military-qualified APA300, APA600 and APA1000 devices are offered in three […]