EM Microelectronic (Marin, Switzerland) announced that it is ready to start producing a high-performance, ultra-low-voltage and ultra-low-power integrated circuit (IC) using fully...
Researchers from the University of Iceland announced the invention of a radical device, the Thermator, which can produce electricity from water. While thermo-electric generators have been used to power spacecraft, using heat from radioactive materials, the Thermator works on nothing more than hot water through use of the thermo-electric effect. Professor Thorstein Sigmarsson of the […]
Tsinghua Huatian Technology Dev. Co. Ltd. (China) announced the new AE-2388 CPU cooler, which features a cooling fan that rotates at 3,000rpm...
Royal Philips Electronics (Eindhoven, the Netherlands) announced a new line of n-channel, MOSFETs in the thin small outline package 6 (TSOP6), based...
Xicor Inc. (Milpitas, CA) introduced the X80010, X80011, X80012 and X80013 smart power management products, which integrate power supply sequencing, system management and hot-swap functions to provide a complete solution that addresses power distribution from a -48V backplane. The hot-swap features of the X80010 family allow for insertion and extraction of line cards, network interface […]
A PC25 fuel cell, manufactured and installed by UTC Fuel Cells (South Windsor, CT), a division of United Technologies Corp. (South Windsor, CT), was unveiled at a ceremony held at South Windsor High School, marking the launch of the state's first municipal facility to be powered and heated by a fuel cell. The South Windsor […]
Texas Instruments Inc. (TI, Dallas, TX) announced two new hot-swap power managers for use in nominal -48V systems, the TPS2392 and TPS2393, which allow precise control of current and voltage during turn-on and operation, and are suitable for -48V distributed power systems, central office switching, optical networking systems and wireless base stations. The TPS2392 and […]
Axcelis Technologies Inc. (Beverly, MA) announced results for its third quarter ended September 30, 2002. Worldwide sales for the quarter (including SEN, Axcelis' unconsolidated joint venture in Japan) were $136.6 million, down two percent sequentially from the second quarter of 2002, and up 25 percent from the third quarter of 2001. Net sales (excluding SEN) […]
Holtek Semiconductor Inc. (Taiwan) introduced its new HT47C10L eight-bit microcontroller, which operates from 1.2V to 2.2V and is designed for use over the -40 to +85 degrees C temperature range. The new microcontrollers are suitable for battery-powered applications, or for use as heat and humidity controllers and tire pressure gauges. The 44-pin QFP device features […]
Trohito Electronic Co. Ltd. (Shenzhen, China) introduced the V155 CPU cooler, which provides an airflow of 27.21cfm, has a rated lifespan of...
Modine Manufacturing Co. (Racine, WI) reported sales of $275.6 million and earnings of $6.3 million, or $0.19 per fully diluted share, for the quarter ended September 26, 2002. Sales increased 2.8 percent from $268.1 million reported a year ago. Modine's income from operations increased 18.2 percent to $10.5 million from $8.9 million. Reported net earnings […]
The board of directors of Modine Manufacturing Co. (Racine, WI) declared a quarterly dividend of $12.5 per share on outstanding common stock, payable December 5, 2002, to all shareholders of record November 22, 2002.
Modine Manufacturing Co. (Racine, WI) announced that its Chief Financial Officer, Ernest T. Thomas, resigned to pursue another employment opportunity. R. Steven Bullmore, Modine's corporate controller, will serve as the interim CFO until the position is permanently filled.
RF Monolithics Inc. (Dallas, TX) reported that net income for the fourth quarter ended August 31, 2002, was $42.0 thousand, or a profit of $0.01 per diluted share, compared to a net loss of $9.8 million, or $1.40 per diluted share, for the fourth quarter of the prior year. The loss in the prior fourth […]
Chomerics (Woburn, MA), a division of Parker Hannifin Corp., introduced its THERM-A-GAP T630 and T630G form-in-place, fully cured, thermally conductive, gap filler materials that provide a highly conformable thermal path between hot components and heat spreaders. The thermal gap fillers are designed to replace gap-filling elastomeric pads that may over-stress component solder joints and leads, […]