Freescale Semiconductor Inc. (Austin. TX), a subsidiary of Motorola Inc. (Austin, TX), has joined STMicroelectronics, Infineon Technologies and Philips to further lead-free electronics packaging and promote a greener industry. Formerly E3, the group is now called E4 (environmental 4) and focuses on accelerating the use of lead-free packages while stimulating further development of environmentally friendly […]
Vishay Intertechnology Inc. (Malvern, PA) announced two new precision thin-film resistor networks that extend the ratio tolerance of the company's MPM and...
RF Micro Devices Inc. (RFMD, Greensboro, NC), a provider of proprietary radio frequency integrated circuits for wireless communications applications, announced that it has established an assembly facility at its Beijing, China, location to provide internal module packaging capabilities. The new assembly operations is expected to become fully operational in the December 2004 quarter. The company […]
NRC Electronics Inc. (Boca Raton, FL) has joined with Design Chain Associates (DCA) and EPTAC Corp. to present a half-day "Introduction to Lead-Free" seminar on the impact of the European Union RoHS and WEEE Hazardous Materials Directives, to be held July 21, 2004, in NRC's Boca Raton facility. The purpose of the seminar is to […]
Tessera Technologies Inc. (San Jose, CA), a developer of semiconductor packaging technology for miniaturization of electronic products, announced that it is raising its financial guidance for the second quarter and full year 2004. For the second quarter ending June 30, 2004, Tessera now expects total revenues in the range of $16.6 to $17 million. Net […]
Nesar Electric Machinery Corp. (China) released its 8023 Series of cooling fans that run at a speed of 2,950 rpm and have...
Mean Well Ent. Co. Ltd. (Taiwan) launched its module dc-dc converters that feature an I/O isolation rating of 1 kVdc, and offer...
Ansoft Corp. (Pittsburgh, PA) announced a collaboration with Synopsys Inc., which will provide streamlined IC and package co-design and analysis design flow solutions to address the substantial challenges of developing products based on 90 nm and System-on-Chip technologies. "Integrated circuit packaging is now in the critical path of silicon product delivery as package I/O counts […]
Nesar Electric Machinery Corp. (China) introduced its new 25090 Series of ball-bearing, ac cooling fans, which come in dimensions of 250(ø) mm...
Tessera Technologies Inc. (San Jose, CA), a developer of semiconductor packaging technology for miniaturization of electronic products, announced the voting results of its annual meeting of stockholders held in Santa Clara, CA. The stockholders approved all matters set forth in the company's proxy statement, including the elections of Patricia Cloherty, Borje Ekholm, John Goodrich, James […]
Vishay Intertechnology Inc. (Malvern, PA) announced that it is offering plug-in versions of all devices in its FunctionPAK® family of fully integrated,...
Dynex Semiconductor Ltd. (Lincoln, UK), a leading power semiconductor technology company, announced the release of the first products in a range of high-efficiency, high-energy, phase-control thyristors (SCRs). The SCR thyristors incorporate process improvements and a new emitter design to achieve improved performance. The new designs offer up to 30 percent more current carrying capacity in […]
Datech Technology Co. Ltd. (Taiwan) introduced its CP4-001 CPU cooler, which is suitable for Intel P4 3.06G processors and comes in dimensions...
Linear Technology Corp. (LTC, Milpitas, CA) introduced its new LT3462/A, a 40 V, 300 mA, inverting dc-dc converter with onboard schottky diode...
Royal Philips Electronics (the Netherlands) announced a significant milestone in putting 90 nm CMOS chips into production by achieving silicon from its CMOS production line at the Crolles2 wafer fab in Crolles, France, and from TSMC's wafer fab in Taiwan. The Philips CMOS090LP is one of the world's first system-on-chip solutions to be fabricated in […]