American Power Conversion Corp. (West Kingston, RI) reported net income for the first quarter ended March 28, 1999, of $34.8 million, or $0.36 per share, up 30 percent from $26.7 million, or $0.28 per share, for the same period a year ago. Sales for the first quarter were $277.2 million, up 27 percent from $218.9 […]
Micro Linear Corp. (San Jose, CA) recently introduced the ML4802, a low-power BiCMOS device that contains an intelligent Green Mode circuit that is claimed to automatically increase power supply efficiency at light loads. The ML4802 works with a wide range of power line input voltages (85-265Vac), making it possible to design universal power supplies that […]
The second annual Engineering Thermoplastics 2001 Conference will be held from April 30 through May 1, 2001, in San Diego, CA at the Sheraton Hotel and Marina. The conference will cover the commercial and technical aspects of the plastics market, bringing together business leaders from material suppliers, processors and OEMs. The program includes sessions on […]
Schaefer Inc. (Ashland, MA) introduced the C5800 Series of 12kW, 6U/9U high, 19" rack compatible dc/dc and ac/dc converters. Typical applications include...
Vicor Corp. (Andover, MA) announced SurfMate, a new surface-mount interface accessory suitable for use with pin-compatible second-generation dc/dc converters. SurfMate, the first in a family of ModuMate interconnect products, utilizes a pair of surface-mounted headers that contain sockets to accept the input and output pins of the converter module. The SurfMate header assembly is compatible […]
Siemens Semiconductors (Munich) announced that it will be spun off to form a separate legal entity, Infineon Technologies AG, on April 1, 1999. The company will have headquarters in Europe. According to the firm, the move is a prerequisite for listing Semiconductors on stock exchanges late this year or early next year. Until then, the […]
Motorola Inc. (Phoenix, AZ) is offering a new searchable CD-ROM for its TMOS Power MOSFETs designed to allow engineers to quickly select the exact device for their applications. The TMOS CD-ROM contains a selector guide, data sheets, device cross-references and application notes in PDF format. Device reliability data, packaging and thermal specifications are also included, […]
Cherry Semiconductor Corp. (East Greenwich, RI) announced the appointment of Joe Reichbach to the position of vice president, worldwide sales and marketing. Reichbach previously served as vice president of sales and marketing for Merix Corp. (Forest Grove, OR), a supplier of advanced interconnect solutions. He will oversee all of Cherry's marketing and sales functions, including […]
Unipower Corp. (Coral Springs, FL) introduced the THIN-400 (MF Series) switching power supplies, which provide 400W in a 1.7 high case. The single-output switchers are available with outputs of 3.3, 5, 12, 15, 24, 28 or 48Vdc and have input power factor correction to meet EN 61000-3-2. Power density is 5.2W per cubic inch. The […]
Cherokee International (Tustin, CA) introduced its Tustin Series of non-isolated dc/dc surface-mount converters. The new LS20 models represent the most recent complement to the company's expanding line of board-mounted dc/dc offerings. The Tustin Series power modules are designed for high-performance DSP and microprocessor circuits and system board-level applications. Cherokee claims that each module employs synchronous […]
Molex Thermal Acoustic Products (Lisle, IL) announced its new radial-fin heatsink, which it claims will cool microprocessors faster and more quietly than...
AVX Corp. (Myrtle Beach, SC) announced that it now offers a two-capacitor array in an 0405 chip. Available in both X7R and...
Microsemi Corp. (Santa Ana, CA) announced the introduction of its UPS840 Powermite 3 low-profile power Schottky diode. Designed for high-density power supply...
Celestica Inc. (Toronto) reported record annual revenue for the year ended December 31, 1998, of $3.2 billion, up 62 percent from $2.0 billion in 1997. The company reported a net loss for the year of $48.5 million, or $0.94 per share, compared to a net loss of $6.9 million, or $0.20 per share in 1997. […]
IXYS Corp. (Santa Clara, CA) recently introduced the ISOPLUS247 plastic encapsulated package in the "hole-less" TO-246 outline with an electrically isolated mounting tab. The new package design replaces the standard copper lead frame with Direct-Copper-Bonded alumina, to which any discrete semiconductors, from diodes to MOSFETs to thyristors, can be soldered. The package can be mounted […]