eupec (Warstein, Germany), a subsidiary of Infineon Technologies AG (Germany), presented its first complete product family complying with the high-level European Union guidelines 2002/95/EG: Restriction of the Use of Certain Hazardous Substances, and also 2002/96/EG: Waste Electrical and Electronic Equipment. The EasyPIM™, EasyPACK, EasyBRIDGE and EasyDUAL low-power IGBT modules are used in industrial applications. "With […]
Micron Technology Inc. (Boise, ID) reported that it is not expecting a fine following Infineon Technologies' fine in September for price-fixing in the DRAM market. Micron is in production with its first flash chip, a 2 Gbit device made on a 90 nm process. "Micron will not be penalized," stated Micron CEO Steve Appleton. "We've […]
Advanced Semiconductor Engineering Inc. (ASE, Taiwan), an IC packaging company, announced its commitment to Ansoft Corp.'s (Pittsburgh, PA) HFSS™, Q3D Extractor™ and AnsoftLinks™ simulation products for IC packaging design and model extraction. ASE's standardization on Ansoft extends the existing investment and commitment to Ansoft solutions. "We are very pleased to have a close partnership with […]
Semiconductor Manufacturing International Corp. (SMIC) has struck a deal with Texas Instruments Inc. (TI, Dallas, TX) to produce 90nm logic wafers. Chinese foundry SMIC said it has ordered tools to produce 90 nm designs, with shipments due in the current quarter and pilot production expected in the first quarter of 2005. SMIC did not disclose […]
Ansoft Corp. (Pittsburgh, PA) announced that it has entered into a $30 million, one-year, secured credit facility with PNC Bank, National Association. The revolving facility replaces the company's previous credit facility terminated during the first quarter. The new facility will be used primarily for general corporate purposes.
Jetcool Electronics Fty (China) released its JT-A02 AMD CPU coolers, designed for AMD Athlon 1.6GHz, Athlon XP up to 3,000+ and Duron...
Suhder Ind. Co. Ltd. (Taiwan) released its SD-203 hysteresis synchronous motors that are suitable for HVAC equipment. The pear-shaped motors feature a...
Mate Technology Co. Ltd. (China) released its PDC-8025 dc cooling fans, suitable for PCs and power supplies, which come in dimensions of...
Advanced Power Technology Inc. (APT, Bend, OR) announced a new product line of standard power modules in the 62 mm x 108 mm SP6-P low-profile package for high-frequency operation and applications where size and particularly thickness is a concern. The low 12 mm profile offers minimum parasitic inductance, solderable pins for easy mounting to a […]
Fairchild Semiconductor International (South Portland, ME) announced a five-year foundry agreement with Jilin Sino-Microelectronics Co. Ltd. (JSMC) to manufacture selected Fairchild MOSFET and bipolar power products. Jilin Sino-Microelectronics will utilize its recently completed wafer fab in Jilin City, Jilin Province in China. Jilin Sino-Microelectronics will provide additional capacity for Fairchild's more mature power products to […]
Tracewell Systems Inc. (Columbus, OH) introduced its Rugged High Power (RHP) for the VXI ultra-light chassis, which is designed for test systems...
Renesas Technology Corp. (San Jose, CA), a joint venture between Hitachi Ltd. and Mitsubishi Electric Corp., has filed a motion for a preliminary injunction in the Tokyo District Court against Nanya Technology Corp.'s (Taiwan) Japan subsidiary for suspension of Nanya's importation, marketing and sales of semiconductor memory products that Renesas believes infringe its semiconductor package […]
Matsushita Electric Industrial Co. Ltd. (Japan) reported that it has joined the International Sematech Manufacturing Initiative (ISMI, Austin, TX), a chip research and development consortium, effective October 1, 2004. A subsidiary of Sematech, ISMI was formed earlier this year as a new consortium dedicated to fab productivity, equipment productivity, metrology, and environment/safety/health. ISMI members include […]
MEMSIC Inc., a supplier of CMOS-based micro electric mechanical systems (MEMS) accelerometers/sensors, has entered into a cooperative marketing and sales agreement with the Sensors and Controls Business of Texas Instruments Inc. (TI, Dallas, TX). Under the agreement, MEMSIC's thermal sensor technology will be made available to the wider automotive market through TI. Texas Instruments will […]
BTU International Inc. (North Billerica, MA), a supplier of advanced thermal processing equipment for advanced materials processing, semiconductor packaging and surface-mount assembly, announced the receipt of an order, valued at approximately $2 million, for an integrated manufacturing line for solid-oxide fuel cell (SOFC) manufacturing. The order is from one of the largest European-based, global leaders […]