COSCO Aluminium Developments Co. Ltd. (China) reports that its new COSCO-7 extruded heatsinks offer increased heat-emissive area and heat-emissive coefficient. The heatsinks...
Chia Cherne Ind. Co. Ltd. (Taiwan) premiered the JAH11C Series of heatsinks designed for CPU coolers in 1U, 2U, slim PC and socket 370A/462 (active) units. The new heatsinks measure 60mm x 60mm, with a thickness of 11.5mm. Chia Cherne's new heatsinks are made of copper C1020. A stacked process has also been employed instead […]
Degree Controls Inc. (degreeC, Milford, NH) announced its entry into the European market with a technical sales and manufacturing engineering support office in Wexford, Ireland, through Thermal Solutions. With degreeC's engineering support, Thermal Solutions will be able to provide integrated products and services such as turn-key fan-tray assemblies, thermal-management controllers, custom heatsinks, thermal analysis and […]
Degree Controls Inc. (Milford, NH) announced the release of the customized Tortoise Back heatsink solution for dc/dc converters used in communications applications. "Given the extreme nature of thermal management issues that the communications industry faces, new designs that resolve specific thermal problems are in strong demand," said Sam Hopp, vice president of sales and marketing. […]
The Department of Energy announced a $3.0 million award to Capstone Turbine Corp. (Chatsworth, CA) to develop microturbine-powered cooling, heating, and power systems. The award is intended for the research, development and testing of packaged cooling, heating and power systems for buildings. "Capstone and the companies that it works with have already made great technological […]
RTP Co. (Winona, MN) announced the opening of RTP Nordic AS (Denmark). RTP's new firm is intended to sell and provide services to molders, extruders and OEMs in Sweden, Norway, Finland, Iceland and Denmark.
International Rectifier (IR, El Segundo, CA) announced the expansion of its line of co-pack IGBTs with the new IRG4BC15UD, IRG4BC15UD-S and IRG4BC20UD-S....
General Semiconductor (Melville, NY) announced a new SMF package that it claims offers the same current and power-handling capability of a power package in an ultra-small package. The SMF matches the JEDEC DO-219 standard outline, with a height of less than 1mm. The footprint allows it to fit on the mounting pad of a number […]
Tadiran Inc. (Port Washington, NY) has teamed up with Andon Electronics (Lincoln, RI) to introduce a new interconnect solution for Tadiran's coin-sized...
Io Ltd. (UK) announced the MPS28-100, a new off-the-shelf 100W power supply for aerospace applications that is capable of converting the standard...
IXYS Corp. (Santa Clara, CA) announced the introduction of an extended new family of power semiconductors in the new isolated TO-220 package. The new plastic package, called ISOPLUS220, has the holeless TO-220 outline, but with a DCB ceramic lead-frame based on the company’s ISOPLUS technology. The new devices announced include new trench-technology MOSFETs in the […]
American Power Conversion (APC, West Kingston, RI) announced that it is expanding its availability solutions to include a new portable 7,200btu air-conditioning unit engineered to safeguard servers, PBXs, Internet-working hardware and sensitive office equipment from the disastrous effects of heat exposure. The new Network AIR 1000 provides supplemental, emergency or temporary cooling. The unit is […]
Aerco Ltd. (UK) introduced the new ABPC range of power connectors. The maximum current rating for the ABPC range is 100A and the operating temperature range is from -55 to 100 degrees C. The connectors are designed for use with single- and three-phase power supplies. The ABPC range of multicontact heavy-duty power connectors is approved […]
Scientists at Oak Ridge National Laboratory (ORNL, Oak Ridge, TN), Motorola Labs (Schaumburg, IL) and Pacific Northwest National Laboratory (PNNL, Richland, WA) have entered a cooperative research and development agreement aimed at increasing the speed of future generations of integrated circuits. Together, the scientists will pursue new materials that they believe may be better, thinner […]
Bel Fuse Inc. (Jersey City, NJ) announced today that it has acquired E-Power Co. Ltd. (China). E-Power is a current licensor to several of the power conversion industry's leading companies. Terms of the acquisition were not disclosed. "The E-Power acquisition will significantly speed the development and introduction of cost-effective low power dc/dc converters for the […]