Philips Semiconductors (Sunnyvale, CA) announced its new low-voltage logic family for portable consumer electronics, computing, networking and telecom applications. The advanced ultra-low voltage CMOS (AUC) is a new family of logic products optimized for 1.8V operations, with an operating voltage range of 0.8V to 3.6V. It is claimed to be the only logic family that […]
Siemens Solar Industries LP (Camarillo, CA) announced its Earthsafe 20 solar-electric system. According to the company, this is the first complete standard system offered in the industry that converts solar power to utility power, provides emergency backup power, and includes all system functions in a single controller unit, which provides conversion from dc to ac, […]
H Power Corp. (Clifton, NJ) announced that its products performed successfully in tests conducted by Concurrent Technologies Corp. (CTC, Johnstown, PA) on behalf of the US Air Force's (USAF) Air Expeditionary Force Battlelab (AEFB), Common Core Power Production (C2P2) Initiative. The US Air Force Battlelabs are chartered to demonstrate the military utility of existing technologies […]
Greenwich Electronics Inc. (East Greenwich, RI) announced a new line of reed switches and relays for use in a variety of automotive,...
Micrel Semiconductor Inc. (San Jose, CA) announced its new miniature, two-zone, thermal supervisor IC for thermal management using embedded thermal diodes. The...
Analog Devices Inc. (Norwood, MA) announced the new ADM3312E and ADM3307E transceivers. The ADM3312E is designed for palmtop computers, PDAs and other...
Chromerics (Woburn, MA) introduced its new THERMFLOW T766 phase-change material, which provides a low thermal resistance path between hot components and heatsinks while allowing easy removal of sinks for reworking operations. The T766 pads include a foil layer that allows heatsinks to be removed without force and without leaving residue to be cleaned from component […]
International Rectifier Corp. (IR, El Segundo, CA) introduced two space-saving devices for high-reliability (hi-rel) power-management circuits in spacecraft, military, oil exploration and...
Astec Power (Carlsbad, CA) announced its new 80A, half-brick, dc/dc converters. The new family is available in two models: an open-face version, the ALH80, or with a heatsink adapter plate attached, the AEH80. Both models have operating efficiencies of 87 percent while delivering 80A, and 88.5 percent at 60A, at an ambient temperature of 25 […]
A second call for papers has been issued for INTELEC 2002, which is to be held September 29 to October 3, 2002, in Montreal, Canada. Abstracts should accurately reflect the content of each proposed technical paper, and must be received by the program committee no later than January 18, 2002. The abstract should not be […]
ChevronTexaco Corp. (San Francisco, CA) announced that its energy services subsidiary, Chevron Energy Solutions LP (Chevron ES), is collaborating with Energy Conversion Devices Inc. (ECD, Troy, MI) to broaden the commercial application of flexible solar-electric roofing materials and high-performance NiMH batteries, as well as hydrogen storage systems and fuel cell technologies. Under a series of […]
H Power Corp. (Clifton, NJ) announced that the company and Gaz de France (France) have installed the first of six beta residential...
Chaozhou Three-Circle Co. Ltd. (China) announced the new LGA Series of fixed inductors, which include the LGA0204, LGA0307 and LGA0410 models, offering...
Lambda (San Diego, CA) announced that it has appointed Don Naab as president. According to company officials, Naab's comprehensive experience in the electronics industry will help Lambda to achieve growth targets and to renew the company's premier position in the power supply industry. "We are pleased to have Don Naab join the Lambda team. His […]
NEC Corp. (Japan) has developed what is claimed to be the world's first single-chip nitride semiconductor power transistor that is capable of achieving a power transmission output of >100W. The chip is designed to add functionality to next-generation mobile phone applications. The device was developed by adopting a high-breakdown hetero-junction that is suitable for high-voltage […]